arXiv subjects

Aryan Afzalian

Publications and source records attributed to Aryan Afzalian.

11 recordsLinked to original sources

arXiv2026

Are gate-all-around 2D CFETs the optimal architecture for the A2 node and beyond?

As logic scaling enters the angstrom era, vertically stacked complementary field-effect transistors (CFETs) based on atomically thin two-dimensional (2D) semiconductors offer a potential route to extend device scaling beyond the A2 node. Here, we develop an A2-oriented 2D CFET integration flow with a CPP of 36 nm and Lg of 10 nm and present initial demonstrations of several key process modules. Despite their atomically thin channels, 2D GAA CFETs do not provide a contacted poly pitch scaling advantage over Si GAA CFETs at the A2 node, because contact formation constraints impose a similar minimum CPP of 36 nm. We also combine a critical assessment with a multiscale power-performance-area (PPA) evaluation framework spanning quantum transport simulations, compact-model generation, A2-targeted 2D CFET gate-all-around (GAA) integration-flow definition, parasitic extraction and circuit-level benchmarking. Our analysis, however, shows that the expected benefits of 2D GAA CFETs are strongly constrained by non-idealities, in particular high contact resistance and dominant layout-induced parasitic capacitances. Although architectural optimization can improve the Ieff/Ceff ratio, the associated rise in absolute capacitance limits circuit-level gains. Meaningful progress will require co-optimization of contacts, transport and parasitics, together with 2D-specific CFET architectures.

physics.app-ph↗

arXiv2025

Ab-initio-NEGF Fundamental Roadmap for Carbon-Nanotube and Two-Dimensional-Material MOSFETs at the Scaling and VDD Limit

Using accurate Hybrid-Functional DFT coupled with the Non-Equilibrium Green's function (NEGF) formalism, we explore and benchmark the fundamental scaling limits of CNT-FETs against Si and 2D-material MoS$_2$ and HfS$_2$ Nanosheets, highlighting their potential for gate length (L) and supply voltage (VDD) scaling down to 5 nm and to 0.5 V, respectively. The highest drive current is achieved by CNT-FETs with sub 1.3 nm diameters down to $L = 9$ nm and using VDD in the 0.45-0.5V range. Below $L = 9$ nm, however, the HfS$_2$ NS offers the best drive and could further scale down to $L = 5$ nm with a reduced VDD of 0.5 V.

cond-mat.mes-hall↗

arXiv2024

Fully coupled electron-phonon transport in two-dimensional-material-based devices using efficient FFT-based self-energy calculations

Self-heating effects can significantly degrade the performance in nanoscale devices. We investigate self-heating effects in such devices based on two-dimensional materials using ab-initio techniques. A new algorithm was developed to allow for efficient self-energy computations, achieving a $\sim$500 times speedup. It is found that for the simple case of free-standing MoS$_2$ without explicit metal leads, the self-heating effects do not result in significant performance degradation.

cond-mat.mes-hall↗

arXiv2023

Pushing the limits of ab-initio-NEGF transport using efficient dissipative Mode-Space algorithms for realistic simulations of low-dimensional semiconductors including their oxide interfaces

We investigate the trade-offs between accuracy and efficiency for several flavors of the dissipative mode-space NEGF algorithm with the self-consistent Born approximation for DFT Hamiltonians. Using these models, we then demonstrate the dissipative self-consistent DFT-NEGF simulations of realistic 2D-material devices including their oxide interfaces with large slab dimensions (up to 1000 atoms) and up to several 100,000 atoms in the full device, pushing the limit of ab-initio transport.

cond-mat.mes-hall↗

arXiv2022

Towards sub-30nm Contacted Gate Pitch, Forked Contact and Dynamically-Doped Nanosheets to Enhance Si and 2D Materials Device Scaling

We propose a novel Forked-Contacts, Dynamically-Doped Multigate transistor as ultimate scaling booster for both Si and 2D materials in aggressively-scaled nanosheet devices. Using accurate dissipative DFT-NEGF atomistic-simulation fundamentals and cell layout extrinsics, we demonstrate superior and optimal device characteristics and invertor energy - delays down to sub-30-nm pitches, i.e., a 10 nm scaling boost compared to the nanosheet MOSFET references.

cond-mat.mes-hall↗

arXiv2021

Advanced DFT-NEGF transport techniques for novel 2D-material and device exploration including HfS2/WSe2 van-der-Waals Heterojunction TFET and WTe2/WS2 metal/semiconductor contact

We present, here, advanced DFT-NEGF techniques that we have implemented in our ATOmistic MOdelling Solver, ATOMOS, to explore transport in novel materials and devices and in particular in van-der-Waals heterojunction transistors. We describe our methodologies using plane-wave DFT, followed by a Wannierization step, and linear combination of atomic orbital DFT, that leads to an orthogonal and non-orthogonal NEGF model, respectively. We then describe in detail our non-orthogonal NEGF implementation including the Sancho-Rubio and electron-phonon scattering within a non-orthogonal framework. We also present our methodology to extract electron-phonon coupling from first principle and include them in our transport simulations. Finally, we apply our methods towards the exploration of novel 2D materials and devices. This includes 2D material selection and the Dynamically-Doped FET for ultimately scaled MOSFETS, the exploration of vdW TFETs, in particular the HfS2/WSe2 TFET that could achieve high on-current levels, and the study of Schottky-barrier height and transport through a metal-semiconducting WTe2/WS2 VDW junction transistor.

cond-mat.mes-hall↗

arXiv2020

Ab-initio NEGF Perspective of Ultra-Scaled CMOS: From 2D-material Fundamentals to Novel Dynamically-Doped Transistors

Using accurate dissipative DFT-NEGF atomistic-simulation techniques within the Wannier-Function formalism, we give a fresh look at the possibility of sub-10 nm scaling for high-performance CMOS applications. We show that a combination of good electrostatic control together with a high mobility is paramount to meet the stringent roadmap targets. Such requirements typically play against each other at sub-10 nm gate length for MOS transistors made of conventional semiconductor materials like Si, Ge or III-V and dimensional scaling is expected to end around 12 nm gate-length. We demonstrate that using alternative 2D channel materials, such as the less explored HfS2 or ZrS2, high-drive current down to about 6 nm is, however, achievable. We also propose a novel transistor concept, the Dynamically-Doped Field-Effect Transistor, that scales better than its MOSFET counterpart. Used in combination with a high-mobility material such as HfS2, it allows for keeping the stringent high-performance CMOS on current and competitive energy-delay performance, when scaling down to 1 nm gate length using a single-gate architecture and an ultra-compact design. The Dynamically-Doped Field-Effect Transistor further addresses the grand-challenge of doping in ultra-scaled devices and 2D materials in particular.

physics.app-ph↗

arXiv2018

A High-Performance InAs/GaSb Core-Shell Nanowire Line-Tunneling TFET: An Atomistic Mode-Space NEGF Study

Using a tight-binding mode-space NEGF technique, we explore the essential physics, design and performance potential of the III-V core-shell (CS) nanowire (NW) heterojunction TFET. The CS TFET line-tunneling current increases significantly with the core diameter $d_{C}$ and outperforms the best III-V axial point-tunneling NW heterojunction TFET $I_{ON}$ by up to 6x for $d_{C}$ = 6.6 nm. Reaching such a high level of current at low supply voltage, however, requires and involves specific and sometime unanticipated optimizations and physics that are thoroughly investigated here. In spite of the commonly accepted view, we also show and explain the weak gate-length dependency observed for the line-tunneling current in a III-V TFET. We further investigate the effect of electron-phonon scattering and discrete-dopant impurity band tails on optimized CS NW TFETs. Including those non-idealities, the CS-TFET inverter performance significantly outperforms that of the axial TFETs. The low-power (LP) VDD = 0.35V CS-inverter delay is comparable to that of the high-performance (HP) Si CMOS using VDD = 0.55V, which shows promise for a LP TFET technology with HP speed.

cond-mat.mes-hall↗

arXiv2017

An efficient tight-binding mode-space NEGF model enabling up to million atoms III-V nanowire MOSFETs and TFETs simulations

We report the capability to simulate in a quantum mechanical tight-binding (TB) atomistic fashion NW devices featuring several hundred to millions of atoms and diameter up to 18 nm. Such simulations go far beyond what is typically affordable with today's supercomputers using a traditional real space (RS) TB Hamiltonian technique. We have employed an innovative TB mode space (MS) technique instead and demonstrate large speedup (up to 10,000x) while keeping good accuracy (error smaller than 1 percent) compared to the RS NEGF method. Such technique and capability open new avenues to explore and understand the physics of nanoscale and mesoscopic devices dominated by quantum effects. In particular, our method addresses in an unprecedented way the technological relevant case of band-to-band tunneling (BTBT) in III-V nanowire MOSFETs and broken gap heterojunction tunnel-FETs (TFETs). We demonstrate an accurate match of simulated BTBT currents to experimental measurements in a [111] InAs NW having a 12 nm diameter and a 300 nm long channel. We apply the predictivity of our TB MS simulations and report an in-depth atomistic study of the scaling potential of III-V GAA nanowire heterojunction n and pTFETs quantifying the benefits of this technology for low-power, low-voltage CMOS application. At VDD = 0.3 V and IOFF = 50 pA/um, the on-current (Ion) and energy-delay product (ETP) gain over a Si NW GAA MOSFET are 58x and 56x respectively.

cond-mat.mes-hall↗

arXiv2017

Control of interlayer delocalization in 2H transition metal dichalcogenides

It is assessed in detail both experimentally and theoretically how the interlayer coupling of transition metal dichalcogenides controls the electronic properties of the respective devices. Gated transition metal dichalcogenide structures show electrons and holes to either localize in individual monolayers, or delocalize beyond multiple layers - depending on the balance between spin-orbit inter- action and interlayer hopping. This balance depends on layer thickness, momentum space symmetry points and applied gate fields. A good quantitative agreement of predictions and measurements of the quantum confined Stark effect in gated MoS2 systems unveils intralayer excitons as major source for the observed photoluminesence.

cond-mat.mes-hall↗

arXiv2011

Low temperature tunneling current enhancement in silicide/Si Schottky contacts with nanoscale barrier width

The low temperature electrical behavior of adjacent silicide/Si Schottky contacts with or without dopant segregation is investigated. The electrical characteristics are very well modeled by thermionic-field emission for non-segregated contacts separated by micrometer-sized gaps. Still, an excess of current occurs at low temperature for short contact separations or dopant-segregated contacts when the voltage applied to the device is sufficiently high. From two-dimensional self-consistent non-equilibrium Green's function simulations, the dependence of the Schottky barrier profile on the applied voltage, unaccounted for in usual thermionic-field emission models, is found to be the source of this deviation.

cond-mat.mtrl-sci↗