Shuting Du | arXiv Science

arXiv2026

200 mm Wafer-Scale Monolithic 3D Integration of Atomic Layer-Deposited Oxide Semiconductors

Monolithic 3D (M3D) integration offers a pathway to overcome the scaling limits of conventional silicon complementary metal-oxide-semiconductor (CMOS) technology by extending dense vertical stacking of multifunctional logic and memory devices. Here, we demonstrate wafer-scale M3D integration of three tiers of atomic-layer-deposited (ALD) indium oxide (InOx)-based devices (>100,000 fabricated), including ferroelectric, enhancement-mode, and depletion-mode field-effect transistors, on 200 mm silicon wafers. We achieve threshold voltage standard deviation as low as 0.04 V, average electron mobility up to 91.6 cm2V-1s-1, and fully functional cross-tier circuits. A four-tier 3D computing-in-memory (CIM) accelerator targeting large language model workloads is developed using a custom InOx process design kit, delivering 1.4x to 2.9x speedup and comparable energy-delay product improvements over 2D baselines. These results establish ALD InOx M3D integration as a scalable and CMOS-compatible platform for next-generation artificial intelligence hardware and advanced electronics.

physics.app-ph↗

arXiv2025

Cross-Layer Design of Vector-Symbolic Computing: Bridging Cognition and Brain-Inspired Hardware Acceleration

Vector Symbolic Architectures (VSAs) have been widely deployed in various cognitive applications due to their simple and efficient operations. The widespread adoption of VSAs has, in turn, spurred the development of numerous hardware solutions aimed at optimizing their performance. Despite these advancements, a comprehensive and unified discourse on the convergence of hardware and algorithms in the context of VSAs remains somewhat limited. The paper aims to bridge the gap between theoretical software-level explorations and the development of efficient hardware architectures and emerging technology fabrics for VSAs, providing insights from the co-design aspect for researchers from either side. First, we introduce the principles of vector-symbolic computing, including its core mathematical operations and learning paradigms. Second, we provide an in-depth discussion on hardware technologies for VSAs, analyzing analog, mixed-signal, and digital circuit design styles. We compare hardware implementations of VSAs by carrying out detailed analysis of their performance characteristics and tradeoffs, allowing us to extract design guidelines for the development of arbitrary VSA formulations. Third, we discuss a methodology for cross-layer design of VSAs that identifies synergies across layers and explores key ingredients for hardware/software co-design of VSAs. Finally, as a concrete demonstration of this methodology, we propose the first in-memory computing hierarchical cognition hardware system, showcasing the efficiency, flexibility, and scalability of this co-design approach. The paper concludes with a discussion of open research challenges for future explorations.

cs.AR↗