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Lizhou Yang

Publications and source records attributed to Lizhou Yang.

3 recordsLinked to original sources

High-Throughput Discovery of Chiral Carbon-Boron Semimetals with Weyl Topology and Phonon-Mediated Superconductivity

Chiral crystals provide a natural platform for unconventional topological fermions, while light-element carbon--boron frameworks are promising for phonon-mediated superconductivity owing to strong covalent bonding and high phonon frequencies. Here, we combine Wyckoff-position-based structure generation with high-throughput first-principles calculations to search for C--B crystals in selected hexagonal chiral space groups. Starting from 972 generated $\mathrm{C}_m\mathrm{B}_n$ structures ($m,n=1\text{--}4$), successive filters based on energetic stability, dynamical stability, electronic metallicity, topological band features, and thermal stability identify six stable candidates: $(\mathrm{C}_3\mathrm{B}_2)_8$, $(\mathrm{C}\mathrm{B}_2)_3$, $(\mathrm{C}\mathrm{B}_4)_6$, $(\mathrm{C}_3\mathrm{B}_2)_6$, $(\mathrm{C}_2\mathrm{B}_3)_6$, and $(\mathrm{C}\mathrm{B}_2)_6$. These materials host diverse topological semimetal states near the Fermi level, including charge-one, charge-two, and charge-three Weyl points, nodal rings, and nodal-surface states. Notably, $(\mathrm{C}_3\mathrm{B}_2)_8$ exhibits screw-symmetry-protected charge-three Weyl points and strong electron--phonon coupling, yielding a McMillan transition temperature of $31.1\,\mathrm{K}$ for the Coulomb pseudopotential parameter $μ^* = 0.10$. In addition, $(\mathrm{C}\mathrm{B}_2)_3$ hosts multiple charge-one Weyl points and pronounced anisotropic multiband superconductivity revealed by fully anisotropic Eliashberg calculations. These results extend the materials scope of topological semimetals with phonon-mediated superconductivity to chemically designed chiral light-element structures.

cond-mat.mtrl-sci↗

Scalable High-Precision Microfabrication on Various Lithography-Incompatible Substrates and Materials Enabled by Wafer-Scale Transfer Lithography of Commercial Photoresists

Photolithography conventionally requires flat, rigid and stable substrates, limiting its applications in flexible, curved, and transient electronics. In this study, a breakthrough approach is reported that employs a reversibly adhesion-switchable phase-changing polymer to universally transfer commercial photoresists onto previously inaccessible substrates, overcoming fundamental limitations of conventional photolithography.

physics.app-ph↗

Microassembly of Multi-Material and 3D Integration Enabled by Programmable and Universal High-Precision Micro-Transfer Printing

Micro-transfer printing is an assembly technology that enables large-scale integration of diverse materials and components from micro- to nano-scale. However, traditional micro-transfer printing technologies lack dynamic selectivity, limiting capabilities in sorting and repairing materials and components for effective yield management during large-scale manufacturing and integration processes. In this work, we introduce a dynamically programmable micro-transfer printing system utilizing a sharp phase-changing polymer and an independently addressable microheater array to modulate adhesion through localized heating. The system demonstrates dynamically programmable capabilities for selective transfer of various materials including semiconductors, polymers and metals, handling geometries from micro-scale chiplets to nanometer-thick films and micro-spheres. It also exhibits exceptional capabilities in 3D stacking and heterogeneous materials integration, significantly advancing the manufacturability of complex microsystems. As a demonstration, we successfully perform dynamically programmable transfer of microLED chips to create arbitrarily specified patterns, offering a promising solution to the challenges of mass transfer and pixel repair in microLED display manufacturing.

physics.app-ph↗