arXiv subjects

Bei Yu

Publications and source records attributed to Bei Yu.

173 records · Page 10Linked to original sources

arXiv2014

EPIC: Efficient prediction of IC manufacturing hotspots with a unified meta-classification formulation

In this paper we present EPIC, an efficient and effective predictor for IC manufacturing hotspots in deep sub-wavelength lithography. EPIC proposes a unified framework to combine different hotspot detection methods together, such as machine learning and pattern matching, using mathematical programming/optimization. EPIC algorithm has been tested on a number of industry benchmarks under advanced manufacturing conditions. It demonstrates so far the best capability in selectively combining the desirable features of various hotspot detection methods (3.5-8.2% accuracy improvement) as well as significant suppression of the detection noise (e.g., 80% false-alarm reduction). These characteristics make EPIC very suitable for conducting high performance physical verification and guiding efficient manufacturability friendly physical design.

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arXiv2014

GLOW: A global router for low-power thermal-reliable interconnect synthesis using photonic wavelength multiplexing

In this paper, we examine the integration potential and explore the design space of low power thermal reliable on-chip interconnect synthesis featuring nanophotonics Wavelength Division Multiplexing (WDM). With the recent advancements, it is foreseen that nanophotonics holds the promise to be employed for future on-chip data signalling due to its unique power efficiency, signal delay and huge multiplexing potential. However, there are major challenges to address before feasible on-chip integration could be reached. In this paper, we present GLOW, a hybrid global router to provide low power opto-electronic interconnect synthesis under the considerations of thermal reliability and various physical design constraints such as optical power, delay and signal quality. GLOW is evaluated with testing cases derived from ISPD07-08 global routing benchmarks. Compared with a greedy approach, GLOW demonstrates around 23%-50% of total optical power reduction, revealing great potential of on-chip WDM interconnect synthesis.

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arXiv2014

TRIAD: a triple patterning lithography aware detailed router

TPL-friendly detailed routers require a systematic approach to detect TPL conflicts. However, the complexity of conflict graph (CG) impedes directly detecting TPL conflicts in CG. This work proposes a token graph-embedded conflict graph (TECG) to facilitate the TPL conflict detection while maintaining high coloring-flexibility. We then develop a TPL aware detailed router (TRIAD) by applying TECG to a gridless router with the TPL stitch generation. Compared to a greedy coloring approach, experimental results indicate that TRIAD generates no conflicts and few stitches with shorter wirelength at the cost of 2.41x of runtime.

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arXiv2014

E-BLOW: E-Beam Lithography Overlapping aware Stencil Planning for MCC System

Electron beam lithography (EBL) is a promising maskless solution for the technology beyond 14nm logic node. To overcome its throughput limitation, recently the traditional EBL system is extended into MCC system. %to further improve the throughput. In this paper, we present E-BLOW, a tool to solve the overlapping aware stencil planning (OSP) problems in MCC system. E-BLOW is integrated with several novel speedup techniques, i.e., successive relaxation, dynamic programming and KD-Tree based clustering, to achieve a good performance in terms of runtime and solution quality. Experimental results show that, compared with previous works, E-BLOW demonstrates better performance for both conventional EBL system and MCC system.

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arXiv2014

Methodology for standard cell compliance and detailed placement for triple patterning lithography

As the feature size of semiconductor process further scales to sub-16nm technology node, triple patterning lithography (TPL) has been regarded one of the most promising lithography candidates. M1 and contact layers, which are usually deployed within standard cells, are most critical and complex parts for modern digital designs. Traditional design flow that ignores TPL in early stages may limit the potential to resolve all the TPL conflicts. In this paper, we propose a coherent framework, including standard cell compliance and detailed placement to enable TPL friendly design. Considering TPL constraints during early design stages, such as standard cell compliance, improves the layout decomposability. With the pre-coloring solutions of standard cells, we present a TPL aware detailed placement, where the layout decomposition and placement can be resolved simultaneously. Our experimental results show that, with negligible impact on critical path delay, our framework can resolve the conflicts much more easily, compared with the traditional physical design flow and followed layout decomposition.

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arXiv2014

Floorplanning and Topology Generation for Application-Specific Network-on-Chip

Network-on-chip (NoC) architectures have been proposed as a promising alternative to classical bus-based communication architectures. In this paper, we propose a two phases framework to solve application-specific NoCs topology generation problem. At floorplanning phase, we carry out partition driven floorplanning. At post-floorplanning phase, a heuristic method and a min-cost max-flow algorithm is used to insert switches and network interfaces. Finally, we allocate paths to minimize power consumption. The experimental results show our algorithm is effective for power saving.

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arXiv2014

Network flow-based simultaneous retiming and slack budgeting for low power design

Low power design has become one of the most significant requirements when CMOS technology entered the nanometer era. Therefore, timing budget is often performed to slow down as many components as possible so that timing slacks can be applied to reduce the power consumption while maintaining the performance of the whole design. Retiming is a procedure that involves the relocation of flip-flops (FFs) across logic gates to achieve faster clocking speed. In this paper we show that the retiming and slack budgeting problem can be formulated to a convex cost dual network flow problem. Both the theoretical analysis and experimental results show the efficiency of our approach which can not only reduce power consumption by 8.9%, but also speedup previous work by 500 times.

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arXiv2014

L-Shape based Layout Fracturing for E-Beam Lithography

Layout fracturing is a fundamental step in mask data preparation and e-beam lithography (EBL) writing. To increase EBL throughput, recently a new L-shape writing strategy is proposed, which calls for new L-shape fracturing, versus the conventional rectangular fracturing. Meanwhile, during layout fracturing, one must minimize very small/narrow features, also called slivers, due to manufacturability concern. This paper addresses this new research problem of how to perform L-shaped fracturing with sliver minimization. We propose two novel algorithms. The first one, rectangular merging (RM), starts from a set of rectangular fractures and merges them optimally to form L-shape fracturing. The second algorithm, direct L-shape fracturing (DLF), directly and effectively fractures the input layouts into L-shapes with sliver minimization. The experimental results show that our algorithms are very effective.

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arXiv2014

Layout decomposition for triple patterning lithography

As minimum feature size and pitch spacing further decrease, triple patterning lithography (TPL) is a possible 193nm extension along the paradigm of double patterning lithography (DPL). However, there is very little study on TPL layout decomposition. In this paper, we show that TPL layout decomposition is a more difficult problem than that for DPL. We then propose a general integer linear programming formulation for TPL layout decomposition which can simultaneously minimize conflict and stitch numbers. Since ILP has very poor scalability, we propose three acceleration techniques without sacrificing solution quality: independent component computation, layout graph simplification, and bridge computation. For very dense layouts, even with these speedup techniques, ILP formulation may still be too slow. Therefore, we propose a novel vector programming formulation for TPL decomposition, and solve it through effective semidefinite programming (SDP) approximation. Experimental results show that the ILP with acceleration techniques can reduce 82% runtime compared to the baseline ILP. Using SDP based algorithm, the runtime can be further reduced by 42% with some tradeoff in the stitch number (reduced by 7%) and the conflict (9% more). However, for very dense layouts, SDP based algorithm can achieve 140x speed-up even compared with accelerated ILP.

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arXiv2014

Triple Patterning Lithography (TPL) Layout Decomposition using End-Cutting

Triple patterning lithography (TPL) is one of the most promising techniques in the 14nm logic node and beyond. However, traditional LELELE type TPL technology suffers from native conflict and overlapping problems. Recently LELEEC process was proposed to overcome the limitations, where the third mask is used to generate the end-cuts. In this paper we propose the first study for LELEEC layout decomposition. Conflict graphs and end-cut graphs are constructed to extract all the geometrical relationships of input layout and end-cut candidates. Based on these graphs, integer linear programming (ILP) is formulated to minimize the conflict number and the stitch number.

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arXiv2014

Self-Aligned Double Patterning Friendly Configuration for Standard Cell Library Considering Placement

Self-aligned double patterning (SADP) has become a promising technique to push pattern resolution limit to sub-22nm technology node. Although SADP provides good overlay controllability, it encounters many challenges in physical design stages to obtain conflict-free layout decomposition. In this paper, we study the impact on placement by different standard cell layout decomposition strategies. We propose a SADP friendly standard cell configuration which provides pre-coloring results for standard cells. These configurations are brought into the placement stage to help ensure layout decomposability and save the extra effort for solving conflicts in later stages.

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