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arXiv · 2211.13989

HexaMesh: Scaling to Hundreds of Chiplets with an Optimized Chiplet Arrangement

Patrick Iff·Maciej Besta·Matheus Cavalcante·Tim Fischer·Luca Benini·Torsten Hoefler
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Abstract

2.5D integration is an important technique to tackle the growing cost of manufacturing chips in advanced technology nodes. This poses the challenge of providing high-performance inter-chiplet interconnects (ICIs). As the number of chiplets grows to tens or hundreds, it becomes infeasible to hand-optimize their arrangement in a way that maximizes the ICI performance. In this paper, we propose HexaMesh, an arrangement of chiplets that outperforms a grid arrangement both in theory (network diameter reduced by 42%; bisection bandwidth improved by 130%) and in practice (latency reduced by 19%; throughput improved by 34%). MexaMesh enables large-scale chiplet designs with high-performance ICIs.

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Patrick Iff, Maciej Besta, Matheus Cavalcante, Tim Fischer, Luca Benini, Torsten Hoefler. 2022-11-25. HexaMesh: Scaling to Hundreds of Chiplets with an Optimized Chiplet Arrangement. https://arxiv.org/abs/2211.13989

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