Challenges in implementing DDR3 memory interface on PCB systems: a methodology for interfacing DDR3 SDRAM DIMM to an FPGA

Phil Murray; Feras Al-Hawari

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arXiv · 2204.05107

Challenges in implementing DDR3 memory interface on PCB systems: a methodology for interfacing DDR3 SDRAM DIMM to an FPGA

Phil Murray·Feras Al-Hawari

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Abstract

Undoubtedly faster, larger and lower power per bit, but just how do you go about interfacing a DDR3 SDRAM DIMM to an FPGA? The DDR3 standard addresses the faster, more bandwidth and lower power per bit need, but it introduces new design challenges in addition to challenges introduced by DDR2 ODT, slew rate derating, etc. The DDR3 fly-by topology requirement means customers designing DDR3 memories must now account for write leveling and read de-skew on the PCB. This paper will cover modeling, simulation, and physical layout approaches required to meet JEDEC-defined termination and tight timing requirements for designing DDR3 memory interfaces on PCB systems.

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Phil Murray, Feras Al-Hawari. 2022-04-07. Challenges in implementing DDR3 memory interface on PCB systems: a methodology for interfacing DDR3 SDRAM DIMM to an FPGA. https://arxiv.org/abs/2204.05107

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