TY  - RPRT
TI  - The application of Artificial Neural Network for the assessment of thermal properties of multi-layer semiconductor structure
AU  - Z. Suszynski
AU  - M. Kosikowski
AU  - R. Duer
PY  - 2007
UR  - https://arxiv.org/abs/0709.1866
ID  - 0709.1866
ER  -