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Zhenghui Ji

Publications and source records attributed to Zhenghui Ji.

2 recordsLinked to original sources

High-performance orbital-torque magnetic memory on the 300-mm platform

Contemporary memory technologies are increasingly constrained by the fundamental trilemma of storage capacity, access latency, and power consumption. Among the emerging technologies, spin-orbit torque magnetic random-access memory (SOT-MRAM) shows promise to circumvent these challenges, owing to its fast switching dynamics and high endurance. However, the application of SOT-MRAM is hindered by the relatively low write and read efficiencies, resulting in a large bitcell area and an insufficient sensing margin. Meanwhile, the involvement of an ultrathin spin-source channel, typically within a few nanometers, imposes technological challenges for mass production. Here, we resolve these issues on a 300-mm wafer platform by exploiting the emerging orbital degree of freedom and the resultant orbital torque (OT) from the relatively thick Ti/W bilayer. In particular, OT memory nanodevices exhibit a giant tunnel magnetoresistance (TMR) of 182%, nanosecond-scale response, 1012 endurance, together with an enhanced switching efficiency (E_b/I_c), which consequently enables an ultra-low write energy of less than 0.1 pJ/bit. Our findings demonstrate that orbital angular momentum can be implemented for building energy-efficient MRAM devices, offering a practical pathway towards low-latency memory that is demanded for high-performance computing and AI applications.

cond-mat.mtrl-sci

Achieving High Yield of Perpendicular SOT-MTJ Manufactured on 300 mm Wafers

The large-scale fabrication of three-terminal magnetic tunnel junctions (MTJs) with high yield is becoming increasingly crucial, especially with the growing interest in spin-orbit torque (SOT) magnetic random access memory (MRAM) as the next generation of MRAM technology. To achieve high yield and consistent device performance in MTJs with perpendicular magnetic anisotropy, an integration flow has been developed that incorporates special MTJ etching technique and other CMOS-compatible processes on a 300 mm wafer manufacturing platform. Systematic studies have been conducted on device performance and statistical uniformity, encompassing magnetic properties, electrical switching behavior, and reliability. Achievements include a switching current of 680 uA at 2 ns, a TMR as high as 119%, ultra-high endurance (over 1012 cycles), and excellent uniformity in the fabricated SOT-MTJ devices, with a yield of up to 99.6%. The proposed integration process, featuring high yield, is anticipated to streamline the mass production of SOT-MRAM.

physics.app-ph