Annealing-Induced Structural and Optical Evolution of Ion-Beam-Sputtered Ta2O5 Films for High-Power Laser Applications
Tantalum pentoxide (Ta2O5) thin films deposited by ion beam sputtering (IBS) are essential components in high-power laser systems, where post-deposition annealing is routinely used to optimize film quality. In this work, we systematically investigate the structural and optical evolution of IBS-deposited Ta2O5 single layers subjected to post-deposition annealing at temperatures from 400 to 800 $^{\circ}\mathrm{C}$. The films undergo an amorphous-to-polycrystalline transition between 600 $^{\circ}\mathrm{C}$ and 700 $^{\circ}\mathrm{C}$, accompanied by a marked increase in surface roughness. Argon bubbles inherently incorporated during IBS serve as structural markers: their size correlates positively with the surface roughness from the as-deposited to 700 $^{\circ}\mathrm{C}$ but decouples at 800 $^{\circ}\mathrm{C}$, revealing a transition from matrix-relaxation-dominated to surface-diffusion-dominated behavior. Transmittance spectra show a red shift at 400 and 600 $^{\circ}\mathrm{C}$ which can be explained by physical thickness increase. Weak absorption decreases from ~6 ppm in as-deposited films to ~2 ppm at 400-600 $^{\circ}\mathrm{C}$ due to annihilation of oxygen vacancies, rises markedly at 700 $^{\circ}\mathrm{C}$ due to grain-boundary defects and then drops again at 800 $^{\circ}\mathrm{C}$ as grain boundaries relax. We identify 400 $^{\circ}\mathrm{C}$ as the optimal annealing window for IBS-deposited Ta2O5 single layers, with the lowest surface roughness and effectively reducing weak absorption while preserving the amorphous phase.