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Simon Pyatt

Publications and source records attributed to Simon Pyatt.

2 recordsLinked to original sources

Development of the kaon tagging system for the NA62 experiment at CERN

The NA62 experiment at CERN aims to make a precision measurement of the ultra-rare decay $K^{+} \rightarrow \pi^{+}\nu\overline{\nu}$, and relies on a differential Cherenkov detector (KTAG) to identify charged kaons at an average rate of 50 MHz in a 750 MHz unseparated hadron beam. The experimental sensitivity of NA62 to K-decay branching ratios (BR) of $10^{-11}$ requires a time resolution for the KTAG of better than 100 ps, an efficiency better than 95% and a contamination of the kaon sample that is smaller than $10^{-4}$. A prototype version of the detector was tested in 2012, during the first NA62 technical run, in which the required resolution of 100 ps was achieved and the necessary functionality of the light collection system and electronics was demonstrated.

physics.ins-det

Alternative glues for the production of ATLAS silicon strip modules for the Phase-II upgrade of the ATLAS Inner Detector

The Phase-II upgrade of the ATLAS detector for the High Luminosity Large Hadron Collider (HL-LHC) includes the replacement of the current Inner Detector with an all-silicon tracker consisting of pixel and strip detectors. The current Phase-II detector layout requires the construction of 20,000 strip detector modules consisting of sensor, circuit boards and readout chips, which are connected mechanically using adhesives. The adhesive between readout chips and circuit board is a silver epoxy glue as was used in the current ATLAS SemiConductor Tracker (SCT). This glue has several disadvantages, which motivated the search for an alternative. This paper presents a study concerning the use of six ultra-violet (UV) cure glues and a glue pad for use in the assembly of silicon strip detector modules for the ATLAS upgrade. Trials were carried out to determine the ease of use, the thermal conduction and shear strength, thermal cycling, radiation hardness, corrosion resistance and shear strength tests. These investigations led to the exclusion of three UV cure glues as well as the glue pad. Three UV cure glues were found to be possible better alternatives. Results from electrical tests of first prototype modules constructed using these glues are presented.

physics.ins-det