Selim Dogru | arXiv Science

arXiv2026

Transforming Computational Lithography with AC and AI -- Faster, More Accurate, and Energy-efficient

From climate science to drug discovery, scientific computing demands have surged dramatically in recent years -- driven by larger datasets, more sophisticated models, and higher simulation fidelity. This growth rate far outpaces transistor scaling, leading to unsustainably rising costs, energy consumption, and emissions. Semiconductor manufacturing is no exception. Computational lithography -- involving transferring circuitry to silicon in diffraction-limited conditions -- is the largest workload in semiconductor manufacturing. It has also grown exceptionally complex as miniaturization has advanced in the angstrom-era, requiring more accurate modeling, intricate corrections, and broader solution-space exploration. Accelerated computing (AC) offers a solution by dramatically freeing up the compute and power envelope. AI augments these gains by serving as high-fidelity surrogates for compute-intensive steps. Together, they present a sustainable, next-generation computing platform for scientific workloads. This new paradigm needs a fundamental redesign of the software stack. For computational lithography, NVIDIA cuLitho reinvents the core primitives -- diffractive optics, computational geometry, multi-variant optimization, data processing -- to achieve a transformative 57X end-to-end acceleration. Beyond dramatically faster cycles, this expanded compute envelope enables more rigorous solutions, including curvilinear masks, high-numerical aperture extreme ultraviolet (high-NA EUV) lithography, and subatomic modeling. We reinvest a small fraction of the freed-up compute to include through-focus correction for better process resilience. Silicon experiments at IMEC show significant benefits compared to conventional methods -- 35% better process window and 19% better edge placement error. This is the first quantified chip-scale demonstration of the lithography benefits of AC and AI in silicon.

eess.SP↗

arXiv2022

An Adversarial Active Sampling-based Data Augmentation Framework for Manufacturable Chip Design

Lithography modeling is a crucial problem in chip design to ensure a chip design mask is manufacturable. It requires rigorous simulations of optical and chemical models that are computationally expensive. Recent developments in machine learning have provided alternative solutions in replacing the time-consuming lithography simulations with deep neural networks. However, the considerable accuracy drop still impedes its industrial adoption. Most importantly, the quality and quantity of the training dataset directly affect the model performance. To tackle this problem, we propose a litho-aware data augmentation (LADA) framework to resolve the dilemma of limited data and improve the machine learning model performance. First, we pretrain the neural networks for lithography modeling and a gradient-friendly StyleGAN2 generator. We then perform adversarial active sampling to generate informative and synthetic in-distribution mask designs. These synthetic mask images will augment the original limited training dataset used to finetune the lithography model for improved performance. Experimental results demonstrate that LADA can successfully exploits the neural network capacity by narrowing down the performance gap between the training and testing data instances.

cs.LG↗