arXiv subjects

Michael Acquah

Publications and source records attributed to Michael Acquah.

2 recordsLinked to original sources

arXiv2026

Generative Design of Liquid-Cooling Channels for Thermal Management of 2.5D and 3D Integrated Advanced Packaging

High-power multi-chip packages require increasingly effective cooling as intensive heat is generated within a limited package area. This work presents a physics-guided generative design framework for liquid-cooling channel topology optimization in a 2.7 kW multi-chip package containing two high-power graphics processing units (GPUs) and one central processing unit (CPU). A conditional diffusion model generates symmetric channel layouts using maximum GPU temperature, GPU temperature spread, and pressure drop as performance targets. Generated designs undergo connectivity and dead-end-branch screening and are evaluated using a calibrated reduced-order thermal-fluids model. Based on 5,000 generated layouts, the multi-objective analysis identified the optimal design for thermal properties, with estimated maximum GPU temperature of 70.30 degree Celsius, GPU temperature spread of 24.90 degree Celsius, and pressure drop of 89.72 kPa. Compared to a conventional reference topology, the optimal design reduced the maximum GPU temperature, temperature spread, and pressure drop by 33.6%, 52.5%, and 72.8%, respectively. High-fidelity three-dimensional conjugate heat-transfer simulation in OpenFOAM estimated a maximum GPU temperature of 66.70 degree Celsius and a pressure drop of 92.1 kPa, showing only differences of 8.6% in temperature rise and 2.6% in pressure drop. The results demonstrate that physics-guided generative design based on the reduced-order model can efficiently discover unconventional cooling channel architectures while reducing reliance on repeating computationally expensive simulation.

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arXiv2026

Cooling Channel Design Optimization for High Power Multi-Chip Packages

Thermal management is a major challenge in next-generation high-performance computing systems, particularly for heterogeneous multi-chip packages such as the NVIDIA GB200 Grace Blackwell Superchip. In this work, a physics-based computational framework is developed to optimize embedded cooling channel layouts for high-power multi-chip modules. The model couples steady-state heat conduction with a porous media-based representation of coolant transport, coupled with a row-wise coolant energy balance, to estimate chip temperature fields within microchannel networks. Unlike conventional designs, an interdigitated cooling architecture is parameterized using geometric variables, including channel count, width, and expansion over chip regions, enabling systematic design exploration. To enable efficient optimization, a surrogate-based approach is employed to approximate the relationship between geometric parameters and temperature metrics. The resulting model is optimized using a mixed-integer quadratic programming algorithm to minimize a weighted objective based on peak and average chip temperatures. To improve physical relevance, channel placement is further constrained to increase cooling coverage near GPU regions, where thermal loads are highest. The framework is applied to a representative multi-chip configuration based on NVIDIA GB200 architecture, consisting of two graphics processing units and one central processing unit. The results demonstrate that the optimal design reduces the peak chip temperature by 140.45{\deg}C and the average chip temperature by 35.87{\deg}C compared to the baseline configuration.

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