arXiv subjects

Marcus Wislicenus

Publications and source records attributed to Marcus Wislicenus.

3 recordsLinked to original sources

arXiv2026

Liquid-Nitrogen Micropillar-Wick Cooling for Cryogenic Electronics: A Numerical Study of Thermal Performance and Capillary Dry-Out Limits

Cryogenic computing technologies are maturing rapidly, but heat removal remains a key challenge when increasing the device density and operating power. Two-phase evaporative cooling is a promising approach to solve this issue, because it can dissipate high heat fluxes while maintaining small temperature rises. Here, we numerically investigate liquid-$\mathrm{N_2}$-filled silicon micropillar wicks as a capillary-fed thin-film evaporation concept for cryogenic electronics. The model combines Young-Laplace meniscus calculations, Hertz-Knudsen-Schrage evaporation, unit-cell heat-transfer and liquid-flow simulations, and an array-level thermal and capillary-flow model. For a representative geometry with a pillar diameter of $10\,μ\mathrm{m}$, pitch of $24\,μ\mathrm{m}$, and pillar height of $75\,μ\mathrm{m}$ at an applied heat flux of $20\,\mathrm{W\,cm^{-2}}$, the predicted chip-temperature rise is approximately $2.7\,\mathrm{K}$. This is substantially below the estimated temperature rises for representative conduction cooling through an indium-interlayered copper heat sink and direct liquid-$\mathrm{N_2}$ immersion. The corresponding predicted single-fed dry-out length is approximately $2.7\,\mathrm{mm}$, equivalent to an ideal double-fed coolable width of approximately $5.3\,\mathrm{mm}$. The results indicate that local thermal performance is favorable, whereas lateral scalability is primarily constrained by capillary dry-out. An approximate capillary-viscous scaling relation provides a compact framework for comparing dry-out limits across working fluids and related wick geometries and for identifying strategies to extend capillary-fed transport.

physics.app-ph↗

arXiv2026

Phononic Bragg Reflectors for Thermal Insulation of Scalable Cryogenic Control Electronics from Qubits

Scaling solid-state architectures to the millions of qubits required for utility-scale quantum computing could benefit from the integration of control electronics in the immediate vicinity of the quantum layer. However, lithographically fabricated solid-state qubits perform best at temperatures well below 1 K, where available cooling power is limited, whereas the control electronics dissipate substantial power and therefore require the higher cooling power available at elevated temperatures. To address this challenge, we propose a cryopackaging concept that uses broadband phononic Distributed Bragg Reflectors (DBRs) as a thermal barrier between cryoelectronics and the qubit chip. As an experimental realization of this concept, we fabricate and characterize Ta/SiO$_2$ DBR structures. In this architecture, the DBR is intended to provide mechanical support for superconducting vias while offering substantially better thermal insulation than typical bulk materials. For a 600-nm-thick DBR consisting of 10 Ta/SiO$_2$ bilayers, we obtain a thermal conduction below 1 mW/cm$^2$ from 1.5 K to 100 mK. In a centimeter-scale architecture, this level of isolation is compatible with Watt-level cooling power for nearby electronics while maintaining a qubit temperature around 100 mK in commercially available dilution refrigerators.

quant-ph↗

arXiv2025

THz electrodynamics and superconducting energy scales of ZrN thin films

The terahertz (THz) properties of ZrN thin films grown with CMOS-techniques on industry-standard 300 mm silicon wafers are investigated in order to explore their superconducting behavior. The films have thicknesses ranging from 18 to 48 nm, and their critical temperatures Tc are between 5 and 7.3 K. We probe the real and imaginary parts of the complex dynamical conductivity sigma in the frequency range from 100 - 540 GHz (0.4 - 2.2 meV) and as a function of temperature. The experiments provide direct access to the low-energy electrodynamics and key materials parameters such as superconducting energy gap and superfluid density. Our findings indicate that ZrN is a weakly coupled BCS-type superconductor with a gap-to-Tc ratio of approximately 3.4 in the thick film limit. For thinner films, this coupling ratio increases up to 4.0, departing from the BCS prediction. The results establish large-scale ZrN thin films as promising material for high-frequency superconducting applications.

cond-mat.supr-con↗