arXiv subjects

Geoffrey Pourtois

Publications and source records attributed to Geoffrey Pourtois.

At least 19 recordsLinked to original sources

arXiv2026

Best Practices for First-Principles Modeling of Amorphous Oxide Semiconductors: A Statistical Framework and Application to Zn-Sn-O

Ternary and quaternary amorphous oxide semiconductors have many properties that make them promising candidates for use in electronic applications like display, memory, and back end of line logic. However, finding the right material for a given application and optimizing its properties, deposition, and integration, requires a thorough understanding of the physics and chemistry at play. When properly carried out, first principles computations can play a crucial role in enhancing this understanding. In this work, we highlight several pitfalls often observed in research applying these computations, with the Zn-Sn-O system as an example. We show that a proper understanding of the fundamental differences between the physics of the crystalline and amorphous or disordered phases is crucial, as is a proper statistical sampling of structural models. For the Zn-Sn-O system we conclude that from a performance point of view, mobility and initial threshold voltage, it is a promising material class. However, our computed results show that a similar sensitivity to hydrogen induced doping may be present as in IGZO.

cond-mat.mtrl-sci↗

arXiv2026

Implementation of rotational invariance for first-principles phonons and application to low-dimensional materials

The acoustic flexural (phonon) modes of low-dimensional materials should show a quadratic dispersion close to the Brillouin zone center. Any departure from this behavior in Density Functional Theory calculations is typically associated with a breaking of the rotational invariance, with few methods available to correct it. In this work, we reexamine this issue based on a reciprocal-space imposition of this condition, with corrections on the zone-center IFCs and their first and second derivatives with respect to the phonon wavevector. We propose two correction schemes for the short-range part of the interatomic force constants, one based on the Moore-Penrose pseudoinverse, that we implement in the ABINIT software package, and one based on the straight modification of the on-site antisymmetric part of the first-order derivative of the dynamical matrix with respect to the wavevector. We investigate the impact of imposing rotational invariance for different system dimensionalities and pseudopotentials. Finally, we discuss rotational invariance in the context of long-range electrostatics contribution to the IFCs. We observe that the usual treatment of electrostatics is by construction not rotationally invariant. This is found especially critical when correcting the second derivatives of the IFCs.

cond-mat.mtrl-sci↗

arXiv2026

Optical-like interference control polar-phonons dispersions in 2D materials

It has been argued that the polar phonon modes of two-dimensional (2D) materials should show a linear dependence close to the Brillouin zone center due to the reduced problem dimensionality compared to a three-dimensional crystal, leading to a vanishing LO-TO splitting. Revisiting this question using a mirror-charge framework derived from classical electrostatics, we show that it is not always true: with perfectly-reflective dielectric interfaces, it is possible to recover a LO-TO splitting, or an equivalent phenomenon for the out-of-plane modes. Effectively, the dispersion of polar phonon modes is governed by optical-like constructive and destructive interferences of the source potential with its reflection at the dielectric interfaces. This work highlights the critical role of dielectric boundary conditions to understand phonon-related properties in 2D materials.

cond-mat.mtrl-sci↗

arXiv2025

Unraveling the Reaction Mechanisms in a Chemically Amplified EUV Photoresist from a Combined Theoretical and Experimental Approach

Extreme ultraviolet (EUV) lithography has revolutionized high-volume manufacturing of nanoscale components, enabling the production of smaller, denser, and more energy efficient integrated circuit devices. Yet, the use of EUV light results in ionization driven chemistry within the imaging materials of lithography, the photoresists. The complex interplay of ionization, generation of primary and secondary electrons, and the subsequent chemical mechanisms leading to image formation in photoresists has been notoriously difficult to study. In this work, we deploy photoemission spectroscopy with a 92 eV EUV light source combined with first-principles simulations to unravel the chemical changes occurring during exposure in a model chemically amplified photoresist. The results reveal a surprising chemical reaction pathway, namely the EUV-induced breakdown of the photoacid generator (PAG), which is a critical component in the EUV mechanism. This previously unobserved reaction mechanism manifests as changes in intensity of the valence band peaks of the EUV photoemission spectrum, which are linked to degradation of the PAG via an advanced atomistic simulation framework. Our combined experimental and theoretical approach shows that EUV photoemission can simultaneously resolve chemical dynamics and the production of primary and secondary electrons, giving unique insights into the chemical transformation of photoresist materials. Our results pave the way for utilizing accessible, table-top EUV spectroscopy systems for observing EUV photoresist chemical dynamics, with the potential for time-resolved measurements of photoemission processes in the future.

cond-mat.mtrl-sci↗

arXiv2025

Fundamental Understanding of Exposure and Process Chemistry for Enhanced Lithography and Stability of Metal Oxide Resists

Metal oxide resists (MORs) have shown great promise for high resolution patterning in extreme ultraviolet (EUV) lithography, with potential for integration into high volume manufacturing. However, MORs have recently been shown to exhibit sensitivity to process conditions and environment, leading to critical dimension (CD) variation. While this variation can be reduced with proper process control, there is little knowledge on how these aspects affect the image formation mechanism. To bridge these knowledge gaps, we deploy a coordinated, fundamentals-focused approach to yield deep insights into MOR exposure and process chemistry. Our results on a model MOR, an n-butyl Sn-Oxo system, reveal how parameters such as exposure dose, post-exposure bake temperature, and atmospheric species influence the image formation mechanism. Our results, and the coordinated approach using correlative spectroscopies, provide a strong foundation for understanding the image formation mechanism in MOR materials with potential to link mechanistic aspects to CD variation.

cond-mat.mtrl-sci↗

arXiv2025

Peak Broadening in Photoelectron Spectroscopy of Amorphous Polymers: the Leading Role of the Electrostatic Landscape

The broadening in photoelectron spectra of polymers can be attributed to several factors, such as light source spread, spectrometer resolution, finite lifetime of the hole state, and solid-state effects. Here, for the first time, we set up a computational protocol to assess the peak broadening induced for both core and valence levels by solid-state effects in four amorphous polymers by using a combination of density functional theory, many-body perturbation theory, and classical polarizable embedding. We show that intrinsic local inhomogeneities in the electrostatic environment induce a Gaussian broadening of $0.2$-$0.7$~eV in the binding energies of both core and semi-valence electrons, corresponding to a full width at half maximum (FWHM) of $0.5$-$1.7$~eV for the investigated systems. The induced broadening is larger in acrylate- than in styrene- based polymers, revealing the crucial role of polar groups in controlling the roughness of the electrostatic landscape in the solid matrix.

cond-mat.mtrl-sci↗

arXiv2025

Exploring binary intermetallics for advanced interconnect applications using ab initio simulations

The challenge of increasing copper (Cu) resistivity with diminishing Cu interconnect dimensions in complementary metal-oxide-semiconductor (CMOS) transistors, along with the imperative for efficient electron transport paths to fulfill scaling requirements in interconnects is significant. First-principles electronic structures calculations based on density functional theory have been performed to evaluate the potential scalability of some Cu, Al, Ru and Mo based binary alloys to replace Cu. We evaluate the expected sensitivity of the resistivity of these binary alloys to reduced line dimensions with a figure of merit that is based on generalized finite-temperature transport tensors. These transport tensors allow for a straightforward comparison between highly anisotropic intermetallics with given transport directions and Cu, and are evaluated together with their resistance to electromigration. Based on the figure-of-merit analysis, we identify several aluminides that show potential to outperform Cu at reduced interconnect dimensions in terms of their electronic transport and reliability properties.

cond-mat.mtrl-sci↗

arXiv2024

Sub-40mV Sigma-VTH IGZO nFETs in 300mm Fab

Back and double gate IGZO nFETs have been demonstrated down to 120nm and 70nm respectively leveraging 300mm fab processing. While the passivation of oxygen vacancies in IGZO is challenging with an integration of front side gate, a scaled back gated flow has been optimized by multiplying design of experiments around contacts and material engineering. We then successfully demonstrated sub-40mV $σ$(VTH_ON) in scaled IGZO nFETs. Regarding the performance and the VTH_ON control, a new IGZO phase is also reported. A model of dopants location is proposed to better explain the experimental results reported in literature.

cond-mat.mtrl-sci↗

arXiv2024

Selecting Alternative Metals for Advanced Interconnects

Interconnect resistance and reliability have emerged as critical factors limiting the performance of advanced CMOS circuits. With the slowdown of transistor scaling, interconnect scaling has become the primary driver of continued circuit miniaturization. The associated scaling challenges for interconnects are expected to further intensify in future CMOS technology nodes. As interconnect dimensions approach the 10 nm scale, the limitations of conventional Cu dual-damascene metallization are becoming increasingly difficult to overcome, spurring over a decade of focused research into alternative metallization schemes. The selection of alternative metals is a highly complex process, requiring consideration of multiple criteria, including resistivity at reduced dimensions, reliability, thermal performance, process technology readiness, and sustainability. This tutorial introduces the fundamental criteria for benchmarking and selecting alternative metals and reviews the current state of the art in this field. It covers materials nearing adoption in high-volume manufacturing, materials currently under active research, and potential future directions for fundamental study. While early alternatives to Cu metallization have recently been introduced in commercial CMOS devices, the search for the optimal interconnect metal remains ongoing.

physics.app-ph↗

arXiv2024

Size Effect on Raman Measured Stress and Strain Induced Phonon Shifts in Ultra-Thin Film Silicon

The fabrication of complex nano-scale structures, which is a crucial step in the scaling of (nano) electronic devices, often leads to residual stress in the different layers present. This stress gradient can change many of the material properties and leads to desired or undesired effects, especially in the active part of the transistor, its channel. Measuring, understanding, and, ultimately, controlling the stress fields is hence crucial for many design steps.The level of stress can in principle be measured by micro-Raman spectroscopy. This, however, requires \emph{a priori} knowledge of the mechanical properties of the material. The mechanical properties start to deviate from the bulk values when film dimensions become thinner than 5 nm. If this effect is ignored, errors of up to 400\% can be introduced in the extracted stress profile. In this work, we illustrate this effect for a range of Si (001) slabs with different silicon film thickness, ranging from 5 to 0.7 nm and provide best practices for the proper interpretation of micro-Raman stress measurements.

cond-mat.mtrl-sci↗

arXiv2024

Cu$_x$Al$_{1-x}$ films as Alternatives to Copper for Advanced Interconnect Metallization

Cu$_x$Al$_{1-x}$ thin films with $0.2 \le x \le 0.7$ have been studied as potential alternatives for the metallization of advanced interconnects. First-principles simulations were used to obtain the Cu$_x$Al$_{1-x}$ electronic structure and cohesive energy to benchmark different intermetallics and their prospects for interconnect metallization. Next, thin Cu$_x$Al$_{1-x}$ films were deposited by PVD with thicknesses in the range between 3 and 28 nm. The lowest resistivities of 9.5 $μΩ$cm were obtained for 28 nm thick stochiometric CuAl and CuAl$_2$ after 400$^\circ$C post-deposition annealing. Based on the experimental results, we discuss the main challenges for the studied aluminides from an interconnect point of view, namely the control of the film stoichiometry, the phase separation observed for off-stoichiometric CuAl and CuAl$_2$, as well as the presence of a nonstoichiometric surface oxide.

cond-mat.mtrl-sci↗

arXiv2024

Al$_3$Sc thin films for advanced interconnect applications

Al$_x$Sc$_{1-x}$ thin films have been studied with compositions around Al$_3$Sc ($x$ = 0.75) for potential interconnect metallization applications. As-deposited 25 nm thick films were x-ray amorphous but crystallized at 190°C, followed by recrystallization at 440°C. After annealing at 500°C, 24 nm thick stoichiometric Al$_3$Sc showed a resistivity of 12.6 $μΩ$cm, limited by a combination of grain boundary and point defect (disorder) scattering. Together with ab initio calculations that found a mean free path of the charge carriers of 7 nm for stoichiometric Al$_3$Sc, these results indicate that Al$_3$Sc bears promise for future interconnect metallization schemes. Challenges remain in minimizing the formation of secondary phases as well as in the control of the non-stoichiometric surface oxidation and interfacial reactions with underlying dielectrics.

cond-mat.mtrl-sci↗

arXiv2023

Dilute Rhenium Doping and its Impact on Intrinsic Defects in MoS2

Substitutionally-doped 2D transition metal dichalcogenides are primed for next-generation device applications such as field effect transistors (FET), sensors, and optoelectronic circuits. In this work, we demonstrate substitutional Rhenium (Re) doping of MoS2 monolayers with controllable concentrations down to 500 parts-per-million (ppm) by metal-organic chemical vapor deposition (MOCVD). Surprisingly, we discover that even trace amounts of Re lead to a reduction in sulfur site defect density by 5-10x. Ab initio models indicate the free-energy of sulfur-vacancy formation is increased along the MoS2 growth-front when Re is introduced, resulting in an improved stoichiometry. Remarkably, defect photoluminescence (PL) commonly seen in as-grown MOCVD MoS2 is suppressed by 6x at 0.05 atomic percent (at.%) Re and completely quenched with 1 at.% Re. Furthermore, Re-MoS2 transistors exhibit up to 8x higher drain current and enhanced mobility compared to undoped MoS2 because of the improved material quality. This work provides important insights on how dopants affect 2D semiconductor growth dynamics, which can lead to improved crystal quality and device performance.

cond-mat.mtrl-sci↗

arXiv2022

First-principles-based screening method for resistivity scaling of anisotropic metals

The resistivity scaling of metals is a crucial limiting factor for further downscaling of interconnects in nanoelectronic devices that affects signal delay, heat production, and energy consumption. Here, we generalize a commonly considered figure of merit for selecting promising candidate metals with highly anisotropic Fermi surfaces in terms of their electronic transport properties at the nanoscale. For this, we introduce a finite-temperature transport tensor, based on band structures obtained from first principles. This transport tensor allows for a straightforward comparison between highly anisotropic metals in nanostructures with different lattice orientations and arbitrary transport directions. By evaluating the temperature dependence of the tensor components, we also assess the validity of a Fermi surface-based evaluation of the transport properties at zero temperature, rather than considering standard operating temperature conditions.

cond-mat.mtrl-sci↗

arXiv2022

Modeling X-ray Photoelectron Spectroscopy of Macromolecules Using GW

We propose a simple additive approach to simulate X-ray photoelectron spectra (XPS) of macromolecules based on the $GW$ method. Single-shot $GW$ ($G_0W_0$) is a promising technique to compute accurate core-electron binding energies (BEs). However, its application to large molecules is still unfeasible. To circumvent the computational cost of $G_0W_0$, we break the macromolecule into tractable building blocks, such as isolated monomers, and sum up the theoretical spectra of each component, weighted by their molar ratio. In this work, we provide a first proof of concept by applying the method to four test polymers and one copolymer, and show that it leads to an excellent agreement with experiments. The method could be used to retrieve the composition of unknown materials and study chemical reactions, by comparing the simulated spectra with experimental ones.

cond-mat.mtrl-sci↗

arXiv2021

Ab initio screening of metallic MAX ceramics for advanced interconnect applications

The potential of a wide range of layered ternary carbide and nitride MAX phases as conductors in interconnect metal lines in advanced CMOS technology nodes has been evaluated using automated first principles simulations based on density functional theory. The resistivity scaling potential of these compounds, i.e. the sensitivity of their resistivity to reduced line dimensions, has been benchmarked against Cu and Ru by evaluating their transport properties within a semiclassical transport formalism. In addition, their cohesive energy has been assessed as a proxy for the resistance against electromigration and the need for diffusion barriers. The results indicate that numerous MAX phases show promise as conductors in interconnects of advanced CMOS technology nodes.

cond-mat.mtrl-sci↗

arXiv2018

Resistivity scaling model for metals with conduction band anisotropy

It is generally understood that the resistivity of metal thin films scales with film thickness mainly due to grain boundary and boundary surface scattering. Recently, several experiments and ab initio simulations have demonstrated the impact of crystal orientation on resistivity scaling. The crystal orientation cannot be captured by the commonly used resistivity scaling models and a qualitative understanding of its impact is currently lacking. In this work, we derive a resistivity scaling model that captures grain boundary and boundary surface scattering as well as the anisotropy of the band structure. The model is applied to Cu and Ru thin films, whose conduction bands are (quasi-)isotropic and anisotropic respectively. After calibrating the anisotropy with ab initio simulations, the resistivity scaling models are compared to experimental resistivity data and a renormalization of the fitted grain boundary reflection coefficient can be identified for textured Ru.

cond-mat.mes-hall↗

arXiv2017

Effects of hole self-trapping by polarons on transport and negative bias illumination stress in amorphous-IGZO

The effects of hole injection in amorphous-IGZO is analyzed by means of first-principles calculations. The injection of holes in the valence band tail states leads to their capture as a polaron, with high self-trapping energies (from 0.44 to 1.15 eV). Once formed, they mediate the formation of peroxides and remain localized close to the hole injection source due to the presence of a large diffusion energy barrier (of at least 0.6eV). Their diffusion mechanism can be mediated by the presence of hydrogen. The capture of these holes is correlated with the low off-current observed for a-IGZO transistors, as well as, with the difficulty to obtain a p-type conductivity. The results further support the formation of peroxides as being the root cause of Negative bias illumination stress (NBIS). The strong self-trapping substantially reduces the injection of holes from the contact and limits the creation of peroxides from a direct hole injection. In presence of light, the concentration of holes substantially rises and mediates the creation of peroxides, responsible for NBIS.

cond-mat.mtrl-sci↗