arXiv ScienceSearch

arXiv subjects

Fangzhou Du

Publications and source records attributed to Fangzhou Du.

3 recordsLinked to original sources

Every Kernel Is a Join: Automatic Multi-GPU Parallelism for AI Computations in Einsummable

Distributing an AI computation across the GPUs of a multi-GPU server is one of the central problems in systems-for-AI. We present Einsummable, a prototype system that accepts a PyTorch-like description of an AI computation and automatically distributes it across a multi-GPU server, with no device assignments, sharding annotations, or communication operations written by the programmer. Einsummable models every operation as a relational join followed by an aggregation over tensor relations, in which the tuples contain sub-tensors. Each operation exposes its possible decompositions through what we call "join-agg specs". An optimizer then selects decompositions across the whole computation to minimize a communication-cost proxy. Because it searches decompositions rather than a menu of named strategies, Einsummable discovers plans that mesh-based auto-parallelizers cannot. Each decomposed operation is implemented by synthesizing an exchange program, which is a topology-aware generalization of Volcano's exchange operator. Einsummable invokes no canned collectives: all communication and aggregation is special-purpose, derived at compile time. Despite being fully automatic, Einsummable can outperform custom-designed implementations. For example, on LLaMA transformer blocks on an eight-GPU A100 server, Einsummable achieves a geometric-mean runtime of 8.97 ms, versus 13.80 ms for hand-tuned PyTorch and 15.90 ms for vLLM.

cs.DC

CSANet: Channel Spatial Attention Network for Robust 3D Face Alignment and Reconstruction

Our project proposes an end-to-end 3D face alignment and reconstruction network. The backbone of our model is built by Bottle-Neck structure via Depth-wise Separable Convolution. We integrate Coordinate Attention mechanism and Spatial Group-wise Enhancement to extract more representative features. For more stable training process and better convergence, we jointly use Wing loss and the Weighted Parameter Distance Cost to learn parameters for 3D Morphable model and 3D vertices. Our proposed model outperforms all baseline models both quantitatively and qualitatively.

cs.CV

Establishing Digital Recognition and Identification of Microscopic Objects for Implementation of Artificial Intelligence (AI) Guided Microassembly

s miniaturization of electrical and mechanical components used in modern technology progresses, there is an increasing need for high-throughput and low-cost micro-scale assembly techniques. Many current micro-assembly methods are serial in nature, resulting in unfeasibly low throughput. Additionally, the need for increasingly smaller tools to pick and place individual microparts makes these methods cost prohibitive. Alternatively, parallel self-assembly or directed-assembly techniques can be employed by utilizing forces dominant at the micro and nano scales such as electro-kinetic, thermal, and capillary forces. However, these forces are governed by complex equations and often act on microparts simultaneously and competitively, making modeling and simulation difficult. The research in this paper presents a novel phenomenological approach to directed micro-assembly through the use of artificial intelligence to correlate micro-particle movement via dielectrophoretic and electro-osmotic forces in response to varying frequency of an applied non-uniform electric field. This research serves as a proof of concept of the application of artificial intelligence to create high yield low-cost micro-assembly techniques, which will prove useful in a variety of fields including micro-electrical-mechanical systems (MEMS), biotechnology, and tissue engineering.

cs.CE