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Danny Wan

Publications and source records attributed to Danny Wan.

At least 19 recordsLinked to original sources

SiMOS quantum-dot spin qubits enabled by extreme-ultraviolet lithography

The realization of large-scale silicon quantum processors requires spin qubits compatible with advanced semiconductor manufacturing technologies, demanding lithographic processes that combine nanometer-scale precision with exceptional uniformity. Although the highest-performing silicon spin qubits demonstrated to date have relied on electron-beam (e-beam) lithography, its serial exposure process limits reproducibility studies and wafer-scale fabrication. Here, we demonstrate high-performance silicon metal-oxide-semiconductor (SiMOS) spin qubits fabricated using extreme-ultraviolet (EUV) lithography in a 300 mm semiconductor pilot line. We report wafer-scale quantum-dot uniformity metrics, including 100 % room-temperature gate-to-gate leakage yield and sub-nanometer control of critical gate dimensions. We characterize four double-dot systems realized in two triple-quantum-dot devices. Gate set tomography (GST) reveals consistently high fidelities across all four systems, with values up to 99.8 % for SPAM, 99.9 % for single-qubit gates, and 99.1 % for two-qubit gates. The devices exhibit highly reproducible exchange turn-on characteristics of 10-13 dec/V, indicating high fabrication uniformity enabled by EUV patterning. These results establish EUV lithography as a viable manufacturing technology for quantum processors based on high-fidelity SiMOS spin qubits.

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Understanding oxide-thickness-dependent variability in dense Si-MOS quantum dot arrays

Achieving uniform and scalable control of semiconductor spin qubits remains a key challenge for large scale quantum computing. In this work, we investigate how gate oxide thickness influences uniformity in dense two dimensional silicon quantum dot arrays. Using a 7 x 7 array fabricated in a 300 mm CMOS-process patterned by EUV lithography, we statistically characterize 392 quantum dots across four different oxide thicknesses. The threshold voltages, capacitances, lever arms, and charging energies are extracted using parallel row based measurements and we identify an optimal SiO2 thickness of 17 nm that minimizes threshold voltage variability below 63 mV standard deviation. Our observations illustrate how multiple sources of disorder can introduce competing oxide-thickness dependencies, resulting in non-monotonic trends. These results provide key design guidelines for dense, scalable silicon spin qubit architectures.

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Valley enhanced Rabi frequency in n-type planar Silicon-MOS quantum dot

Electron spin resonance spectroscopy (ESR) of a single electron in planar Si-MOS quantum dot is reported in the vicinity of a valley level anti-crossing. A number of one and two-photon resonances are observed due to mixing of magnetic spin-flip and electric valley-flip transitions. This allows the reconstruction of the energy-level diagram of a four state system with two valley and two spin states. Near the anti-crossing, an enhancement of the Rabi frequency is observed. This is attributed to an electric-dipole transition activated by admixing of the upper energy level due to inter-valley spin coupling. The electric-dipole transition may be driven via capacitive coupling between the ESR antenna, and the confinement gate. To characterize spin-valley coupling responsible for the enhancement, we measure the anisotropy of the g-factor difference between the two valley states, the mean g-factor and the inter-valley spin coupling for both in and out-of-plane magnetic fields. The inter-valley spin coupling is strongly modulated by the direction of the B-field, and is strongest for out-of-plane B-field, consistent with an in-plane spin-valley field. In principle, this strong Electric dipole spin resonance (EDSR) effect could be utilized for fast all-electrical spin control in small-scale devices.

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CryoCMOS RF multiplexer for superconducting qubit control, readout and flux biasing at millikelvin temperatures with picowatt power consumption

Large-scale cryogenic quantum systems are constrained by an input-output bottleneck between room-temperature electronics and millikelvin stages, particularly in superconducting qubit platforms. This bottleneck is most acute for output lines, where bulky and expensive microwave components limit scalability. A promising approach for scalable characterization and testing is to perform signal multiplexing directly at the qubit plane. We demonstrate a cryogenic CMOS (cryoCMOS) RF multiplexer operating at 10 millikelvin with record-low static power consumption of 200 pW. The device provides < 2 dB insertion loss and > 30 dB isolation across DC-8 GHz. Direct connection to transmon qubits marginally affects coherence times in the range of 100 microseconds, enabling multiplexing of readout, flux and, in principle, XY drive lines. This work introduces cryoCMOS multiplexers as valuable tools for scalable, high-throughput cryogenic characterization and testing, and advances co-integrated quantum-classical control for future large-scale quantum processors.

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Concatenated continuous driving of silicon qubit by amplitude and phase modulation

The rate of coherence loss is lower for a qubit under the Rabi drive than a freely evolving qubit $T_{2}^{\rm{Rabi}}>T_{2}^*$. Building on this principle, concatenated continuous driving (CCD) keeps the qubit under continuous drive to suppress noise and manipulate dressed states by either phase or amplitude modulation. In this work, we propose a variant of CCD which simultaneously modulates both the amplitude and phase of the driving field to generate a circularly polarized field in the rotating frame of the carrier frequency. This circular-modulated CCD(CMCCD) cancels the counter-rotating term in the second rotating frame, eliminating a systematic pulse-area error that arises from an imperfect rotating wave approximation for fast gates. Numerical simulations demonstrate that the proposed CMCCD achieves higher gate fidelity than conventional CCD schemes. We further implement and compare different CCD protocols using an electron spin-qubit in an isotopically purified $^{28}$Si-MOS quantum dot and evaluate its robustness by applying static detuning and Rabi frequency errors. The robustness is significantly improved compared with the standard Rabi drive, showing the effectiveness of this scheme for qubit arrays with variation in qubit frequency, coupling to the Rabi drive, and low-frequency noise. The proposed scheme can be applied to various physical systems, including trapped atoms, cold atoms, superconducting qubits, and NV centers.

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Long coherence silicon spin qubit fabricated in a 300 mm industrial foundry

Silicon spin qubits offer long coherence times, a compact footprint and compatibility with industrial CMOS manufacturing. Here, we investigate spin qubits hosted in quantum dots fabricated in a state-of-the-art 300 mm nanoelectronics foundry and demonstrate substantially enhanced coherence, achieving a Hahn-echo time of $T_2^{\text{Hahn}} = 4\,\mathrm{ms}$ for singlet--triplet oscillations. Employing noise spectroscopy and noise correlation measurements, we identify detuning noise with an amplitude of $\delta \varepsilon_{\mathrm{rms}} = 2.2\,\mu\mathrm{eV}$ (integrated over 90 s) and observe strong zero-phase correlations between two spatially separated spin qubits. The singlet--triplet basis intrinsically rejects these common-mode fluctuations, yielding a pronounced suppression of dephasing. Our results suggest that exploiting the versatility of silicon quantum dots to adapt the qubit encoding to the microscopic noise landscape represents a promising strategy for advancing scalable quantum information processing.

cond-mat.mes-hall

Eight-Qubit Operation of a 300 mm SiMOS Foundry-Fabricated Device

Silicon spin qubits are a promising platform for quantum computing due to their high coherence, controllability, and CMOS manufacturability, yet scalable implementations have so far been limited to a few qubits. Here, to take a step towards larger qubit systems, we tune and coherently control an eight-dot linear array of silicon spin qubits fabricated in a 300~mm CMOS-compatible foundry process, establishing operational scalability beyond the two-qubit regime. All eight qubits are successfully tuned and characterized as four double-dot pairs, exhibiting Ramsey dephasing times $T_2^*$ up to 41(2)$~\mu$s and Hahn-echo coherence times $T_2^{\mathrm{Hahn}}$ up to 1.31(4)$~$ms. Readout of the central four qubits is achieved via a cascaded charge-sensing protocol, enabling high-fidelity measurements of the entire multi-qubit array in a two step process. Additionally, we demonstrate a two-qubit gate operation between adjacent qubits with low phase noise. We show that silicon spin qubit arrays can be scaled to medium-sized arrays of 8 qubits while maintaining system coherence.

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High Fidelity Qubit Control in a Natural Si-MOS Quantum Dot using a 300 mm Silicon on Insulator Wafer

We demonstrate high-fidelity single qubit control in a natural Si-MOS quantum dot fabricated in an industrial 300 mm wafer process on a silicon on insulator (SOI) wafer using electron spin resonance. A relatively high optimal Rabi frequency of 5 MHz is achieved, dynamically decoupling the electron spin from its 29-Si environment. Tracking the qubit frequency reduces the impact of low frequency noise in the qubit frequency and improves the $T^{Rabi}$ from 7 to 11 $\mu$s at a Rabi frequency of 5 MHz, resulting in Q-factors exceeding 50. Randomized benchmarking returns an average single gate control fidelity of 99.5 $\pm$ 0.3%. As a result of pulse-area calibration, this fidelity is limited by the Rabi Q-factor. These results show that a fast Rabi frequency, low charge noise, and a feedback protocol enable high fidelity in these Si-MOS devices, despite the low-frequency magnetic noise.

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Multimode RF Reflectometry for Spin Qubit Readout and Device Characterization

We introduce a multimode superconducting inductor architecture that enables radio-frequency reflectometry at multiple discrete frequencies up to 2 GHz, addressing limitations of conventional single-mode designs. The spiral inductor's distributed inter-turn capacitance yields distinct resonant modes with varied impedance-matching conditions. By probing a quantum dot across several modes, we extract tunneling rates over a broad frequency range and identify signatures of nearby charge defects. Using one of the higher-order modes, we demonstrate single-shot spin readout via a radio-frequency single-electron transistor (RF-SET), achieving singlet-triplet readout with an integration time of 8 us and a readout fidelity of 98%. These results establish multimode inductance as a scalable and flexible component for fast spin-qubit readout and device-quality characterization.

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Hybrid Quantum Systems: Coupling Single-Molecule Magnet Qudits with Industrial Silicon Spin Qubits

Molecular spin qudits offer an attractive platform for quantum memory, combining long coherence times with rich multi-level spin structures. Terbium bis(phthalocyaninato) (TbPc$_2$) exemplifies such systems, with demonstrated quantum control and chemical reproducibility. In hybrid quantum architectures, TbPc$_2$ can act as the primary memory element, with semiconductor qubits providing scalable readout and coupling. Here we present a step toward such a hybrid system: using an industrially manufactured silicon metal-oxide-semiconductor (SiMOS) spin qubit to detect electronic spin transitions of an ensemble of TbPc$_2$ molecules. The readout is based on a compact and robust protocol that applies a microwave pulse while all gate voltages defining the qubit are held at a fixed operating point. This protocol, which combines simultaneous Rapid adiabatic Passage and Spin- Selective tunneling (RPSS), enables high-contrast resonance detection and avoids repeated $\pi$-pulse recalibration common in decoupling schemes. By demonstrating ensemble detection, we establish a foundation for integrating molecular quantum memories with industrial qubit platforms and mark an important step toward single-molecule hybrid quantum technologies.

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Rapid Autotuning of a SiGe Quantum Dot into the Single-Electron Regime with Machine Learning and RF-Reflectometry FPGA-Based Measurements

Spin qubits need to operate within a very precise voltage space around charge state transitions to achieve high-fidelity gates. However, the stability diagrams that allow the identification of the desired charge states are long to acquire. Moreover, the voltage space to search for the desired charge state increases quickly with the number of qubits. Therefore, faster stability diagram acquisitions are needed to scale up a spin qubit quantum processor. Currently, most methods focus on more efficient data sampling. Our approach shows a significant speedup by combining measurement speedup and a reduction in the number of measurements needed to tune a quantum dot device. Using an autotuning algorithm based on a neural network and faster measurements by harnessing the FPGA embedded in Keysight's Quantum Engineering Toolkit (QET), the measurement time of stability diagrams has been reduced by a factor of 9.8. This led to an acceleration factor of 2.2 for the total initialization time of a SiGe quantum dot into the single-electron regime, which is limited by the Python code execution.

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Precision high-speed quantum logic with holes on a natural silicon foundry platform

Silicon spin qubits in gate-defined quantum dots leverage established semiconductor infrastructure and offer a scalable path toward transformative quantum technologies. Holes spins in silicon offer compact all-electrical control, whilst retaining all the salient features of a quantum dot qubit architecture. However, silicon hole spin qubits are not as advanced as electrons, due to increased susceptibility to disorder and more complex spin physics. Here we demonstrate single-qubit gate fidelities up to 99.8% and a two-qubit gate quality factor of 240, indicating a physical fidelity limit of 99.7%. These results represent the highest performance reported in natural silicon to date, made possible by fast qubit control, exchange pulsing, and industrial-grade fabrication. Notably, we achieve these results in a near-identical device as used for highly reproducible, high-fidelity electron spin qubits. With isotopic purification and device-level optimisations in the future, our hole spin qubits are poised to unlock a new operation regime for quantum CMOS architectures.

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Statistical Analysis of Spurious Dot Formation in SiMOS Single Electron Transistors

The spatial distribution of spurious dots in SiMOS single-electron transistors (SETs), fabricated on an industrial 300 mm process line, has been statistically analyzed. To have a deeper understanding of the origin of these spurious dots, we analyzed SETs with three different oxide thicknesses: 8 nm, 12 nm and 20 nm. By combining spurious dot triangulation cryo-measurement with simulations of strain, gate bias, and location of the electron wave function, we demonstrate that most spurious dots are formed through the combined effects of strain and gate bias, leading to variations in the conduction band energy. Despite the similar thermal expansion coefficients of polycrystalline silicon gates and single-crystalline silicon substrates, strain remains a crucial factor in spurious dots formation. This learning can be use to optimize the device design and the oxide thickness, to reduce the density of spurious dot while keeping quantum dot tunability.

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A 300 mm foundry silicon spin qubit unit cell exceeding 99% fidelity in all operations

Fabrication of quantum processors in advanced 300 mm wafer-scale complementary metal-oxide-semiconductor (CMOS) foundries provides a unique scaling pathway towards commercially viable quantum computing with potentially millions of qubits on a single chip. Here, we show precise qubit operation of a silicon two-qubit device made in a 300 mm semiconductor processing line. The key metrics including single- and two-qubit control fidelities exceed 99% and state preparation and measurement fidelity exceeds 99.9%, as evidenced by gate set tomography (GST). We report coherence and lifetimes up to $T_\mathrm{2}^{\mathrm{*}} = 30.4$ $\mu$s, $T_\mathrm{2}^{\mathrm{Hahn}} = 803$ $\mu$s, and $T_1 = 6.3$ s. Crucially, the dominant operational errors originate from residual nuclear spin carrying isotopes, solvable with further isotopic purification, rather than charge noise arising from the dielectric environment. Our results answer the longstanding question whether the favourable properties including high-fidelity operation and long coherence times can be preserved when transitioning from a tailored academic to an industrial semiconductor fabrication technology.

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Industrial 300$\,$mm wafer processed spin qubits in natural silicon/silicon-germanium

The realisation of an universal quantum computer will require the operation of thousands to millions of qubits. The possibility of using existing industrial semiconductor fabrication techniques and infrastructure for up-scaling and reproducibility makes silicon based spin qubits one of the most promising platforms to achieve this goal. The implementation of the up to now largest semiconductor based quantum processor was realized in a silicon/silicon-germanium heterostructure known for its low charge noise, long qubit coherence times and fast driving speeds, but the high structural complexity creates challenges for industrial implementations. Here we demonstrate quantum dots hosted in a natural Si/SiGe heterostructure fully fabricated by an industrial 300$\,$mm semiconductor wafer process line from heterostructure growth to Co micromagnet monolithic integration. We report charge noise values below 2$\,\mathrm{\mu eV/\sqrt{Hz}}$, spin relaxation times of over 1$\,$s and coherence times $T_2^*$ and $T_2^H$ of 1$\,\mathrm{\mu s}$ and 50$\,\mathrm{\mu s}$ respectively, for quantum wells grown using natural silicon. Further, we achieve Rabi frequencies up to 5$\,$MHz and single qubit gate fidelities above 99$\,\%$. In addition to scalability, the high reproducibility of the 300$\,$mm processes enables the deterministic study of qubit metric dependencies on process parameters, which is essential for optimising qubit quality.

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High-coherence superconducting qubits made using industry-standard, advanced semiconductor manufacturing

The development of superconducting qubit technology has shown great potential for the construction of practical quantum computers. As the complexity of quantum processors continues to grow, the need for stringent fabrication tolerances becomes increasingly critical. Utilizing advanced industrial fabrication processes could facilitate the necessary level of fabrication control to support the continued scaling of quantum processors. However, these industrial processes are currently not optimized to produce high coherence devices, nor are they a priori compatible with the commonly used approaches to make superconducting qubits. In this work, we demonstrate for the first time superconducting transmon qubits manufactured in a 300 mm CMOS pilot line, using industrial fabrication methods, with resulting relaxation and coherence times already exceeding 100 microseconds. We show across-wafer, large-scale statistics studies of coherence, yield, variability, and aging that confirm the validity of our approach. The presented industry-scale fabrication process, using exclusively optical lithography and reactive ion etching, shows performance and yield similar to the conventional laboratory-style techniques utilizing metal lift-off, angled evaporation, and electron-beam writing. Moreover, it offers potential for further upscaling by including three-dimensional integration and additional process optimization using advanced metrology and judicious choice of processing parameters and splits. This result marks the advent of more reliable, large-scale, truly CMOS-compatible fabrication of superconducting quantum computing processors.

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Low charge noise quantum dots with industrial CMOS manufacturing

Silicon spin qubits are among the most promising candidates for large scale quantum computers, due to their excellent coherence and compatibility with CMOS technology for upscaling. Advanced industrial CMOS process flows allow wafer-scale uniformity and high device yield, but off the shelf transistor processes cannot be directly transferred to qubit structures due to the different designs and operation conditions. To therefore leverage the know-how of the micro-electronics industry, we customize a 300mm wafer fabrication line for silicon MOS qubit integration. With careful optimization and engineering of the MOS gate stack, we report stable and uniform quantum dot operation at the Si/SiOx interface at milli-Kelvin temperature. We extract the charge noise in different devices and under various operation conditions, demonstrating a record-low average noise level of 0.61 ${\mu}$eV/${\sqrt{Hz}}$ at 1 Hz and even below 0.1 ${\mu}$eV/${\sqrt{Hz}}$ for some devices and operating conditions. By statistical analysis of the charge noise with different operation and device parameters, we show that the noise source can indeed be well described by a two-level fluctuator model. This reproducible low noise level, in combination with uniform operation of our quantum dots, marks CMOS manufactured MOS spin qubits as a mature and highly scalable platform for high fidelity qubits.

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Modelling semiconductor spin qubits and their charge noise environment for quantum gate fidelity estimation

The spin of an electron confined in semiconductor quantum dots is currently a promising candidate for quantum bit (qubit) implementations. Taking advantage of existing CMOS integration technologies, such devices can offer a platform for large scale quantum computation. However, a quantum mechanical framework bridging a device's physical design and operational parameters to the qubit energy space is lacking. Furthermore, the spin to charge coupling introduced by intrinsic or induced Spin-Orbit-Interaction (SOI) exposes the qubits to charge noise compromising their coherence properties and inducing quantum gate errors. We present here a co-modelling framework for double quantum dot (DQD) devices and their charge noise environment. We use a combination of an electrostatic potential solver, full configuration interaction quantum mechanical methods and two-level-fluctuator models to study the quantum gate performance in realistic device designs and operation conditions. We utilize the developed models together alongside the single electron solutions of the quantum dots to simulate one- and two- qubit gates in the presence of charge noise. We find an inverse correlation between quantum gate errors and quantum dot confinement frequencies. We calculate X-gate fidelities >97% in the simulated Si-MOS devices at a typical TLF densities. We also find that exchange driven two-qubit SWAP gates show higher sensitivity to charge noise with fidelities down to 91% in the presence of the same density of TLFs. We further investigate the one- and two- qubit gate fidelities at different TLF densities. We find that given the small size of the quantum dots, sensitivity of a quantum gate to the distance between the noise sources and the quantum dot creates a strong variability in the quantum gate fidelities which can compromise the device yields in scaled qubit technologies.

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