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Bochen Ye

Publications and source records attributed to Bochen Ye.

2 recordsLinked to original sources

BenDi: An Energy-Efficient Quasi-Stochastic Systolic Architecture for Edge Bioelectronics

Continuous long-term monitoring and diagnosis of biomedical signals, such as electrocardiograms (ECGs), can help mitigate an increasing threat to public health. Artificial Intelligence (AI) models, such as Convolutional Neural Networks (CNNs), provide accurate monitoring and classification for relevant diseases; however, they require more computational resources than conventional AI hardware can typically afford, especially for a resource-constrained environment on the edge. In this work, we present BenDi, an energy-efficient quasi-stochastic systolic architecture for bioelectronic systems on the edge. BenDi leverages multiple levels of energy and power optimization, ranging from circuits to software quantization, including low supply voltage, the \underline{Ben}t-Pyramid data format for quasi-stochastic multiplication, the \underline{Di}P systolic dataflow, and hardware-aware quantization, to handle CNNs with high accuracy on the edge within limited hardware budgets. The hardware implementation results, using a commercial 22nm technology, show that BenDi architecture, at 0.5 Voltage and 100 MHz, offers 3.35x smaller area and 5x higher energy efficiency, compared to state-of-the-art binary-based weight-stationary systolic architectures. Regarding Bioelectronic edge systems, BenDi achieves an order-of-magnitude improvement in energy efficiency and another order-of-magnitude improvement in area efficiency, compared to its counterparts. This significant improvement comes at the cost of 1\% to 3.3\% accuracy loss on the MIT-BIH and Apnea-ECG benchmarks, respectively, compared with conventional computing using the 32-bit floating-point format.

cs.AR

LinkBo: An Adaptive Single-Wire, Low-Latency, and Fault-Tolerant Communications Interface for Variable-Distance Chip-to-Chip Systems

Cost-effective embedded systems necessitate utilizing the single-wire communication protocol for inter-chip communication, thanks to its reduced pin count in comparison to the multi-wire I2C or SPI protocols. However, current single-wire protocols suffer from increased latency, restricted throughput, and lack of robustness. This paper presents LinkBo, an innovative single-wire protocol that offers reduced latency, enhanced throughput, and greater robustness with hardware-interrupt for variable-distance inter-chip communication. The LinkBo protocol-level guarantees that high-priority messages are delivered with an error detection feature in just 50.4 $\mu$s, surpassing current commercial options, 1-wire and UNI/O by at least 20X and 6.3X, respectively. In addition, we present the hardware architecture for this new protocol and its performance evaluation on a hardware platform consisting of two FPGAs. Our findings demonstrate that the protocol reliably supports wire lengths up to 15 meters with a data rate of 300 kbps, while reaching a maximum data rate of 7.5 Mbps over an 11 cm wire, providing reliable performance for varying inter-chip communication distances.

cs.AR