arXiv subjects

Alexandra Schewski

Publications and source records attributed to Alexandra Schewski.

3 recordsLinked to original sources

arXiv2026

Substrate-metal interface engineering enhances TaN/Ta thin film superconducting resonator performance

Tantalum has been demonstrated as a promising material for superconducting qubits. However, comparatively little attention has been given to its nitrides. Tantalum nitride exhibits a range of stoichiometries, resulting in a variety of material properties, including both superconducting and non-superconducting phases. Owing to this versatility, tantalum nitrides can serve multiple purposes in superconducting qubits: as seed layers for alpha-Ta growth, as a superconducting base material and as a non-superconducting barrier in the Josephson junction. In this study, we explore the performance of superconducting TaN and Ta thin film combinations on silicon substrates in terms of internal quality factor Qi. We find that standalone TaN films exhibit Qi values of about 1.5x10^5 at 100mK in the single-photon regime. Surprisingly, a resonator made from Ta grown on a few-nanometers-thick TaN seed layer yields largely the same performance. However, adding an additional, few-nanometers-thick Ta buffer layer between the Si substrate and this TaN seed layer enhances Qi significantly up to 5.9x10^5. Supporting transmission electron microscopy measurements reveal nitrogen accumulation and structural disorder at the TaN-Si interface, while this interfacial modification is suppressed when the Ta buffer layer is introduced. The observed improvement in resonator performance is consistent with a reduction of interface-related two-level system losses and strongly supports the hypothesis that controlling the substrate-metal interface is pivotal for the performance of superconducting qubit circuitry.

cond-mat.mtrl-sci↗

arXiv2026

Optimizing CMOS-compatible, superconducting titanium nitride resonators: Deposition conditions and structuring processes

We report on the fabrication and characterization of superconducting coplanar waveguide (CPW) resonators based on titanium nitride (TiN) thin films deposited on 200\,mm diameter high-resistivity Si(100) substrates. We systematically investigate how deposition conditions, dry-etch power and in-situ resist strip temperature affect morphology, superconducting properties and dielectric losses. By tuning reactive sputtering conditions, three distinct preferred out-of-plane crystal orientations - (111), (200), and a mix of both are achieved. Our results demonstrate that all films exhibit similar minimal two-level system (TLS) losses, with TiN111 exhibiting the lowest median TLS losses $\tilde{\delta}_\mathrm{TLS}$, and greater robustness against reoxidation. The applied structuring process, in contrast, has a far greater influence on the TLS loss than the crystal orientation of the TiN film and, consequently, the intrinsic material properties of the superconducting layer. The lowest TLS losses for all TiN depositions were achieved with a low power etch and low temperature resist strip. An additional buffered oxide etch (BOE) treatment could remove high-loss interfacial oxides at the metal-air (MA) and substrate-air (SA) interface and recover the etch-induced TLS losses. Consequently, TiN resonators exhibiting $\tilde{\delta}_\mathrm{TLS}$ values as low as $9.67 \times 10^{-7}$ were realized. The corresponding median low-power loss, $\tilde{\delta}_\mathrm{LP}$, amounts to $11.04 \times 10^{-7}$, which translates to an internal quality factor approaching one million. These findings highlight the critical role of process induced oxide formation at the MA and SA interfaces in limiting the performance of TiN resonators and provide a scalable, low-loss process compatible with industry-grade 200\,mm CMOS qubit fabrication workflows.

quant-ph↗

arXiv2025

Wafer-Scale Characterization of Al/AlxOy/Al Josephson Junctions at Room Temperature

Josephson junctions (JJs) are the key element of many devices operating at cryogenic temperatures. Development of time-efficient wafer-scale JJ characterization for process optimization and control of JJ fabrication is essential. Such statistical characterization has to rely on room temperature techniques since cryogenic measurements typically used for JJs are too time consuming and unsuitable for wafer-scale characterization. In this work, we show that from room temperature capacitance and current-voltage measurements, with proper data analysis, we can independently obtain useful parameters of the JJs on wafer-scale, like oxide thickness, tunnel coefficient, and interfacial defect densities. Moreover, based on detailed analysis of current vs voltage characteristics, different charge transport mechanisms across the junctions can be distinguished. We exemplary demonstrate the worth of these methods by studying junctions fabricated on 200 mm wafers with an industrially scale-able concept based on subtractive processing using only CMOS compatible tools. From these studies, we find that our subtractive fabrication approach yields junctions with quite homogeneous average oxide thickness across the full wafers, with a spread of less then 3$\,$%. The analysis also revealed a variation of the tunnel coefficient with oxide thickness, pointing to a stoichiometry gradient across the junctions' oxide width. Moreover, we estimated relatively low interfacial defect densities in the range of 70 - 5000$\,$defects/cm$^2$ for our junctions and established that the density increased with decreasing oxide thickness, indicating that the wet etching process applied in the JJs fabrication for oxide thickness control leads to formation of interfacial trap state

quant-ph↗