Alexander Madden | arXiv Science

arXiv2026

Transmon Architecture for Emission and Detection of Single Microwave Photons

We develop a compact transmon emitter/detector (TED) superconducting circuit and demonstrate its dual functionality as a single-photon source and detector. In our setup, photons emitted by a source TED are transmitted via a meter-long coaxial cable, routed through a circulator, and captured by a measurement TED. Both TED modules operate with nominally identical parameters, highlighting the flexibility of this novel architecture. Furthermore, we introduce an efficient microwave photon detection scheme tailored to the TED. Using this setup, we detect 60% of the emitted Fock state photons and infer a 95% detection efficiency at the input of the measurement TED, which we calibrate against coherent state measurements. The reset and photon emission/detection processes each require approximately $2\,\mu s$, yielding a minimum protocol duration of $4\,\mu s$ as constrained by our chosen TED parameters. Ultimately, the TED demonstrates a new use case for the recently developed double transmon coupler (DTC): a compact, drop-in, tunable, and transition-selective link between a coherent data transmon and a waveguide. Circuits like the TED will play a vital role in quantum information processing by facilitating unconditional fast reset, enabling microwave photon metrology, and serving as nascent quantum communication interfaces (QCIs). QCIs mediate entanglement distribution between quantum processing units (QPUs) within a cryostat or interface with microwave-to-optical transducers for long-range quantum networking.

quant-ph↗

arXiv2025

Ta-based Josephson junctions using insulating ALD TaN tunnel barriers

Josephson junctions form the core circuit element in superconducting quantum computing circuits, single flux quantum digital logic circuits, and sensing devices such as SQUIDs. Aluminum oxide has typically been used as the tunnel barrier. Its formation by exposure to low oxygen pressures at room temperature for short periods of time makes it susceptible to aging and limits the thermal budget of downstream processes. In this paper, we report the first demonstration of {\alpha}-Ta/insulating TaN/a-Ta superconductor/insulator/superconductor Josephson junctions fabricated on 300 mm wafers using CMOS-compatible processes. The junctions were fabricated on high-resistivity silicon substrates using standard processes available at 300 mm scale, including 193 nm optical lithography, ALD of TaN in a cluster tool, and chemical mechanical planarization to enable highly planar interfaces. Junction areas ranging from 0.03 um2 to 9 um2 with ALD TaN thickness between 2 nm and 7 nm were characterized. A critical current density of 76 uA/um2 was observed in junctions using 4 nm ALD TaN in the tunnel barrier. The dependence of Jc on ALD TaN layer thickness is analyzed, and the influence of junction geometry, packaging, and temperature on I-V characteristics is discussed. Junctions were retested after a period of 4 months to quantify junction aging. The potential of this novel material system and a 300 mm superconducting junction process flow to fabricate thermally and environmentally stable junctions is discussed. The vision of a Superconducting Quantum Process Design Kit for a Multi-Project Wafer program to enable rapid development and proliferation of superconducting quantum and digital digital logic systems is presented. This work represents the first step towards establishing such a Quantum Foundry, providing access to high quality qubits and single-flux quantum logic circuits at 300 mm wafer scale.

cond-mat.supr-con↗