arXiv subjects

Ajit Dash

Publications and source records attributed to Ajit Dash.

6 recordsLinked to original sources

arXiv2026

Dispersive Readout of a SiMOS Quantum Dot Using a Flip-Chip Integrated Microwave Resonator

Heterogeneous integration provides a promising route to combine semiconductor quantum dot devices and superconducting microwave circuits, while allowing each component to be fabricated using an optimized process flow. Here, we demonstrate a flip-chip integrated platform for dispersive readout of silicon metal-oxide semiconductor (SiMOS) quantum dot devices. A SiMOS double quantum dot chip is bonded to a superconducting aluminum resonator chip using indium bump interconnects to enable microwave coupling to the quantum dot gate. We show that the developed flip-chip process is compatible with cryogenic operation of both the SiMOS device and the superconducting resonator, and demonstrate resonator-based detection of charge transitions in the quantum dot system. The readout signal-to-noise ratio follows a dependence of $\sqrt{t}$ with the integration time, reaching SNR = 1 at an integration time of approximately 0.3 ms. These results establish flip-chip bonding as a viable integration approach for SiMOS quantum dot devices operating at both dc and microwave frequencies, with potential applications for resonator-based techniques such as spin-photon coupling.

cond-mat.mes-hall↗

arXiv2026

SiMOS quantum-dot spin qubits enabled by extreme-ultraviolet lithography

The realization of large-scale silicon quantum processors requires spin qubits compatible with advanced semiconductor manufacturing technologies, demanding lithographic processes that combine nanometer-scale precision with exceptional uniformity. Although the highest-performing silicon spin qubits demonstrated to date have relied on electron-beam (e-beam) lithography, its serial exposure process limits reproducibility studies and wafer-scale fabrication. Here, we demonstrate high-performance silicon metal-oxide-semiconductor (SiMOS) spin qubits fabricated using extreme-ultraviolet (EUV) lithography in a 300 mm semiconductor pilot line. We report wafer-scale quantum-dot uniformity metrics, including 100 % room-temperature gate-to-gate leakage yield and sub-nanometer control of critical gate dimensions. We characterize four double-dot systems realized in two triple-quantum-dot devices. Gate set tomography (GST) reveals consistently high fidelities across all four systems, with values up to 99.8 % for SPAM, 99.9 % for single-qubit gates, and 99.1 % for two-qubit gates. The devices exhibit highly reproducible exchange turn-on characteristics of 10-13 dec/V, indicating high fabrication uniformity enabled by EUV patterning. These results establish EUV lithography as a viable manufacturing technology for quantum processors based on high-fidelity SiMOS spin qubits.

cond-mat.mes-hall↗

arXiv2026

Gate Stack Engineering for High-Mobility and Low-Noise SiMOS Quantum Devices

We systematically investigate the interplay between materials engineering, quantum transport, and low-frequency charge noise in silicon metal--oxide--semiconductor (SiMOS) quantum devices. By combining Hall-bar transport measurements with charge-noise spectroscopy of gate-defined quantum dots, we identify correlations between gate-stack design, carrier mobility, and electrostatic noise, providing an experimental case study of material and process dependencies relevant to low-noise, high-mobility operation. Hall-bar studies reveal that increasing the atomic-layer-deposition temperature of Al$_2$O$_3$ markedly enhances mobility, whereas the choice of oxidant has little impact. Devices incorporating HfO$_2$ exhibit improved carrier mobility, an interesting observation that can plausibly be attributed to defect passivation associated with aluminum diffusion from the gate metal into the HfO$_2$ layer. Charge-noise measurements show a strong correlation between higher mobility and reduced noise, with TiPd-gated devices displaying both degraded transport and elevated charge noise. In contrast, the poly-Si-gated CMOS-foundry device achieves the lowest noise levels. Finally, dual-feedback dot--sensor stability mapping demonstrates enhanced charge stability in devices with the gate stacks studied here, underscoring their promise for scalable, high-fidelity silicon spin-qubit platforms.

cond-mat.mes-hall↗

arXiv2025

Interplay of Zeeman Splitting and Tunnel Coupling in Coherent Spin Qubit Shuttling

Spin shuttling offers a promising approach for developing scalable silicon-based quantum processors by addressing the connectivity limitations of quantum dots. In this work, we demonstrate high-fidelity bucket-brigade spin shuttling in a silicon MOS device, utilizing Pauli-spin-blockade readout. We achieve an average shuttling fidelity of \SI{99.8}{\percent}. The residual shuttling error is highly sensitive to the ratio between interdot tunnel coupling and Zeeman splitting, with tuning of these parameters enabling up to a 20-fold variation in error rate. An appropriate four-level Hamiltonian model supports our findings. These results provide valuable insights for optimizing high-performance spin-shuttling systems in future quantum architectures.

cond-mat.mes-hall↗

arXiv2025

Scalable quantum current source on commercial CMOS process technology

Many quantum technologies require a precise electrical current standard that can only be achieved with expensive cryogenics, or through the secondary standards, such as resistance or voltage. Silicon-based charge pumps could provide such a standard in an inherently scalable way, through their compatibility with complementary metal-oxide-semiconductor (CMOS) fabrication methods. However, coherent quantized charge transfer has so far been demonstrated only in nanoscale devices that are custom-fabricated in academic cleanrooms or research technology foundries. Here, we show that a CMOS device manufactured with commercial 22-nm process node can be used to define a quantum current standard in the International System of Units (SI). We measure an accuracy of (1.2 +/- 0.1)E-3 A/A at 50 MHz with reference to SI voltage and resistance standards in a pumped helium system. We then propose a practical monolithic CMOS chip that incorporates one million parallel connected charge pumps along with on-chip control electronics. This chip could be operated as a table-top primary standard that can be easily integrated with CMOS electronics, generating quantum currents of up to microampere levels.

physics.app-ph↗

arXiv2023

Silicon charge pump operation limit above and below liquid helium temperature

Semiconductor tunable barrier single-electron pumps can produce output current of hundreds of picoamperes at sub ppm precision, approaching the metrological requirement for the direct implementation of the current standard. Here, we operate a silicon metal-oxide-semiconductor electron pump up to a temperature of 14 K to understand the temperature effect on charge pumping accuracy. The uncertainty of the charge pump is tunnel limited below liquid helium temperature, implying lowering the temperature further does not greatly suppress errors. Hence, highly accurate charge pumps could be confidently achieved in a $^4$He cryogenic system, further promoting utilization of the revised quantum current standard across the national measurement institutes and industries worldwide.

cond-mat.mes-hall↗