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Interplay between grain boundary grooving, stress, and dealloying in the agglomeration of NiSi1-xGex films

H. B. Yao·M. Bouville·D. Z. Chi·H. P. Sun·X. Q. Pan·D. J. Srolovitz·D. Mangelinck
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Abstract

Germanosilicides, especially those formed on compressive substrates, are less stable than silicides against agglomeration. By studying the solid-state reaction of Ni thin film on strained Si0.8Ge0.2(001), we show that nickel germanosilicide is different from nickel silicide and nickel germanide in several respects: the grains are smaller and faceted, the groove angle is sharper, and dealloying takes place. The germanium out-diffusion creates a stress in the film which favors grooving and agglomeration.

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H. B. Yao, M. Bouville, D. Z. Chi, H. P. Sun, X. Q. Pan, D. J. Srolovitz, D. Mangelinck. 2006-05-18. Interplay between grain boundary grooving, stress, and dealloying in the agglomeration of NiSi1-xGex films. https://doi.org/10.1149/1.2400726

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