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arXiv · 2610.09359

Electromagnetically Transmissive and Thermally Opaque Engineered Microwave Interconnect

Abstract

In a standard two-conductor microwave transmission line, both the signal trace and the wide ground plane act as parasitic heat leakage paths along the propagation direction. To prevent this heat leakage, we devised a single-conductor microwave interconnect: the ground plane is removed entirely and the remaining signal trace is periodically fragmented into physically isolated metallic islands. We show that despite the galvanic isolation between adjacent metal islands, a surface confined mode of specific symmetry, the odd-symmetric spoof surface plasmon polariton, propagates through this periodic, single-conductor medium. This odd symmetry imposes an electromagnetic field null at the waveguide centerline, allowing complete removal of the metal at periodic intervals along the single-conductor waveguide without impacting EM propagation. Measurements on fabricated prototypes confirm the transmission response despite the physical fragmentation of the conductor, with de-embedded propagation loss of ~0.0031 dB/mm across a 5-6.5 GHz passband. Time-domain characterization verifies 1 Gbps amplitude-modulated data transmission with less than 145 ps group delay variation. Coupled electro-thermal simulation yields an effective thermal conductivity of 0.336 W/m*K, a 40x reduction relative to a continuous microstrip line of identical footprint.

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Md. Jawad Ul Islam, Ishrat Jahan, Abdelrahman Omar, Md. Omar Faruk Noman, Md Zunaid Baten, Soumitra R. Joy. 2026-10-07. Electromagnetically Transmissive and Thermally Opaque Engineered Microwave Interconnect. https://arxiv.org/abs/2610.09359

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