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arXiv · 2606.15391

Multi-channel high-speed flip-chip packaging platform for thin-film lithium niobate photonic circuits

Zhenzheng Wang·Xiangzhi Xie·Yikun Chen·Yifan Wu·Zeyu Luo·Hanke Feng·Yulong Chen·Zengyi Xu·Zixi Wang·Yuansong Zeng·Mandie Huang·Ke Zhang·Yingxia Liu·Cheng Wang
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Abstract

To address the urgent need for multi-channel high-speed electrical interfacing of thin-film lithium niobate (TFLN) photonic circuits, we realize a flip-chip packaging platform capable of simultaneously delivering 13 high-speed and 32 low-speed electronic signals to a centimeter-sized TFLN chip. The platform exhibits low flip-chip bonding loss and low inter-channel crosstalk over a broad bandwidth up to 50 GHz. Leveraging this packaging platform, we demonstrate high-speed electrical interfacing with two proof-of-concept TFLN photonic circuits, namely a 2x8 optical switch and an electro-optic comb-based transmitter. The switch achieves arbitrary 8-channel routing with ~3 dB insertion loss, < -20 dB crosstalk, and an equipment-limited switching time of <= 34 ps. The transmitter circuit includes a 50 GHz electro-optic comb generator with 2.8-dB flatness, a tunable microring to arbitrarily filter one comb line, and a modulator for data transmission at 20 Gbit/s. The packaging platform could significantly advance large-scale TFLN circuits in optical communications, microwave photonics, and photonic computing.

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Zhenzheng Wang, Xiangzhi Xie, Yikun Chen, Yifan Wu, Zeyu Luo, Hanke Feng, Yulong Chen, Zengyi Xu, Zixi Wang, Yuansong Zeng, Mandie Huang, Ke Zhang, Yingxia Liu, Cheng Wang. 2026-06-13. Multi-channel high-speed flip-chip packaging platform for thin-film lithium niobate photonic circuits. https://arxiv.org/abs/2606.15391

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