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arXiv · 2606.03285

Spatially Uniform and Defect-Tolerant Plasmonic Responses in 3D printed Gold Nanoparticle Assemblies

Abstract

Three-dimensional (3D) assemblies of gold nanoparticles (AuNPs) offer a rich platform for plasmonic coupling and near-field engineering, yet their optical behavior is often complex due to structural disorder and fabrication-induced variability. Here, we present a systematic optical investigation of large-scale 3D AuNP assemblies fabricated via meniscus-guided assembly, focusing on the reproducibility and spatial uniformity. Spatially-resolved dark-field scattering measurements reveal that high-aspect-ratio AuNP pillars exhibit uniform scattering spectra along their height and across different pillars, despite variations in geometry and structure. Electromagnetic simulations suggest that this robustness arises from an ensemble-averaged plasmonic response governed by many local coupling regions within a finite plasmon delocalization length. Simulated near-field and surface charge distributions suggest that the broad ensemble response remains spatially distributed under representative structural perturbations, consistent with volumetric averaging. Building on this robust platform, we introduce compositional modulation through a core-satellite architecture by incorporating smaller AuNPs. This yields a composition-dependent spectral redistribution, including an additional long-wavelength spectral feature in the core-satellite assemblies. Wavelength-dependent surface-enhanced Raman scattering measurements reveal contrasting responses under 633 and 785 nm excitation, reflecting redistribution of local plasmonic coupling pathways. These results establish design principles for robust 3D plasmonic nanoparticle assemblies with ensemble-averaged and composition-tunable optical responses.

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Vasanthan Devaraj, Sunghyun Kwak, Hyeongjip Kim, Sang-Keun Sung, Jong-Min Lee, Thomas Zentgraf, Won-Geun Kim. 2026-06-02. Spatially Uniform and Defect-Tolerant Plasmonic Responses in 3D printed Gold Nanoparticle Assemblies. https://arxiv.org/abs/2606.03285

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