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arXiv · 2605.11488

Breaking the scalability barrier via a vertical tunable coupler in 3D integrated transmon system

Xudong Liao·Shuyi Pan·Zhenxing Zhang·Sainan Huai·Zhiwen Zong·Xiaopei Yang·Kunliang Bu·Wen Zheng·Xinsheng Tan·Yang Yu·Yuan Li·Yi-Cong Zheng·Tianqi Cai·Shengyu Zhang
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Abstract

Scaling superconducting quantum processors beyond the constraints of monolithic planar architectures is essential for fault-tolerant quantum computation. Here we demonstrate a three-dimensional (3D) integrated superconducting quantum processor in which two qubit chips are vertically stacked on opposing sides of a carrier chip and galvanically connected via multilayer flip-chip bonding. Intrachip qubit coupling is mediated by planar tunable couplers, whereas interchip coupling is enabled by vertical tunable couplers embedded in the carrier chip. Randomized benchmarking reveals simultaneous single-qubit gate fidelities of 99.87 % with negligible crosstalk, and controlled-Z gates achieve an average fidelity of 97.5 % for both intrachip and interchip operations. We further demonstrate high-fidelity Bell-state preparation and coherent generation of a four-qubit $W$ state, confirming the architecture's capability for interchip entanglement distribution. These results establish vertical coupling as a promising pathway toward scalable quantum processors compatible with advanced quantum error-correcting codes.

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Xudong Liao, Shuyi Pan, Zhenxing Zhang, Sainan Huai, Zhiwen Zong, Xiaopei Yang, Kunliang Bu, Wen Zheng, Xinsheng Tan, Yang Yu, Yuan Li, Yi-Cong Zheng, Tianqi Cai, Shengyu Zhang. 2026-05-12. Breaking the scalability barrier via a vertical tunable coupler in 3D integrated transmon system. https://arxiv.org/abs/2605.11488

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