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arXiv · 2604.12539

Thermal Characterization of Buried Interfaces in Multilayer Heterostructures via TDTR with Periodic Waveform Analysis

Mingzhen Zhang·Puqing Jiang·Ronggui Yang
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Abstract

Accurate evaluation of buried thermal interfaces is vital for understanding and optimizing heat dissipation in wide- and ultra-wide-bandgap (WBG/UWBG) semiconductor devices. Conventional time-domain thermoreflectance (TDTR) typically probes only near-surface transport due to its restricted modulation frequency range. Here, we employ a frequency-tunable periodic waveform analysis TDTR (PWA-TDTR) technique to perform depth-resolved thermal measurements on three representative systems: epitaxial ε-Ga2O3/SiC, GaN/Si, and mechanically bonded GaN/diamond. By combining broadband multi-frequency probing with sensitivity-guided joint fitting, we quantitively determine interfacial thermal conductance, layer-specific thermal conductivity, and volumetric heat capacity, without requiring destructive sample preparation. The results reveal that the buried Ga2O3/SiC interface exhibits weak phonon transmission due to acoustic mismatch; the transition layers in GaN/Si act as phonon-impedance gradients that redistribute heat flux; and the GaN/diamond boundary remains the dominant thermal bottleneck despite diamond's ultrahigh bulk conductivity. These findings demonstrate that the modulation frequency in PWA-TDTR functions as a tunable probe of depth-dependent phonon transport, directly linking frequency-domain thermal response to interfacial energy transmission. Overall, this work positions PWA-TDTR as a versatile platform for investigating buried nonmetal-nonmetal interfaces in next-generation high-power and optoelectronic materials.

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Mingzhen Zhang, Puqing Jiang, Ronggui Yang. 2026-04-14. Thermal Characterization of Buried Interfaces in Multilayer Heterostructures via TDTR with Periodic Waveform Analysis. https://arxiv.org/abs/2604.12539

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