arXiv · 2601.08515
Advances in All-Silicon Waveguides for Terahertz Integration
Abstract
In chip-to-chip communication, terahertz waves provide a promising approach to achieve high data capacity with improved energy efficiency, effectively bridging the gap between electrical and optical domains. By realizing this potential, all-dielectric waveguides have emerged as high-speed interconnects, offering broad bandwidth and low-loss characteristics while being compatible with planar integration. This paper reviews different types of terahertz all-dielectric waveguides, including photonic-crystal and effective-medium-clad structures, and highlights recent progress in implementing these platforms to develop various passive functional devices, paving the way for high-speed operation and large-scale integration in terahertz systems.
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Nguyen H. Ngo, Weijie Gao, Masayuki Fujita. 2026-01-13. Advances in All-Silicon Waveguides for Terahertz Integration. https://arxiv.org/abs/2601.08515
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