Deep Learning-based Multi Project InP Wafer Simulation for Unsupervised Surface Defect Detection

Emílio Dolgener Cantú; Rolf Klemens Wittmann; Oliver Abdeen; Patrick Wagner; Wojciech Samek; Moritz Baier; Sebastian Lapuschkin

arXiv · 2506.10713

Deep Learning-based Multi Project InP Wafer Simulation for Unsupervised Surface Defect Detection

Emílio Dolgener Cantú·Rolf Klemens Wittmann·Oliver Abdeen·Patrick Wagner·Wojciech Samek·Moritz Baier·Sebastian Lapuschkin

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Abstract

Quality management in semiconductor manufacturing often relies on template matching with known golden standards. For Indium-Phosphide (InP) multi-project wafer manufacturing, low production scale and high design variability lead to such golden standards being typically unavailable. Defect detection, in turn, is manual and labor-intensive. This work addresses this challenge by proposing a methodology to generate a synthetic golden standard using Deep Neural Networks, trained to simulate photo-realistic InP wafer images from CAD data. We evaluate various training objectives and assess the quality of the simulated images on both synthetic data and InP wafer photographs. Our deep-learning-based method outperforms a baseline decision-tree-based approach, enabling the use of a 'simulated golden die' from CAD plans in any user-defined region of a wafer for more efficient defect detection. We apply our method to a template matching procedure, to demonstrate its practical utility in surface defect detection.

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BibTeX RIS

Emílio Dolgener Cantú, Rolf Klemens Wittmann, Oliver Abdeen, Patrick Wagner, Wojciech Samek, Moritz Baier, Sebastian Lapuschkin. 2025-06-12. Deep Learning-based Multi Project InP Wafer Simulation for Unsupervised Surface Defect Detection. https://arxiv.org/abs/2506.10713

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