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arXiv · 2502.05997

Ultralow-loss photonic integrated chips on 8-inch anomalous-dispersion Si$_3$N$_4$-SiO$_2$-Si Wafer

Shuai Liu·Matthew W. Puckett·Jianfeng Wu·Abdulkarim Hariri·Yuheng Zhang·Zheshen Zhang
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Abstract

We report the fabrication of 8-inch crack-free, dispersion-engineered Si$_3$N$_4$-SiO$_2$-Si wafers fully compatible with industrial foundry silicon photonics fabrication lines. By combining these wafers with a developed amorphous silicon (a-Si) hardmask etching technique, we achieve ultra-low-loss Si$_3$N$_4$ photonic integrated circuits (PICs) with intrinsic quality factors exceeding $25 \times 10^6$ using electron beam lithography and $24 \times 10^6$ using standard ultraviolet stepper photolithography. Frequency-comb generation is demonstrated on these high-quality Si$_3$N$_4$ PICs, corroborating the designed anomalous dispersion. These results establish the feasibility of mass-manufacturing high-performance, dispersion-engineered Si$_3$N$_4$ PICs using standard foundry-grade processes, opening new pathways for applications in optical communications, nonlinear optics, and quantum optics.

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Shuai Liu, Matthew W. Puckett, Jianfeng Wu, Abdulkarim Hariri, Yuheng Zhang, Zheshen Zhang. 2025-02-09. Ultralow-loss photonic integrated chips on 8-inch anomalous-dispersion Si$_3$N$_4$-SiO$_2$-Si Wafer. https://arxiv.org/abs/2502.05997

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