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arXiv · 2501.08948

Compositional dependence of magnetic damping in sputter-deposited CoxFe1-x thin films

Samanvaya S. Gaur·Rosa Diaz·Ernesto E. Marinero
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Abstract

Co25Fe75 ferromagnetic films exhibit ultralow magnetic damping. The magnetic damping dependence of Cobalt Iron thin films over a Co composition (23 to 36%) is here reported. The thin film structures were sputter deposited at ambient temperature and FMR measurements in both in plane and out of plane geometries were utilized to measure magnetic damping parameters, which include intrinsic damping and contributions from spin pumping. The damping parameters, decrease as the Co content is increased, except for Co31Fe69. The smallest values of damping correspond to alloys exhibiting interface perpendicular magnetic anisotropy. A value of 0.00091 was measured for Co36Fe64, whereas for Co31Fe69 was measured as 0.002, this composition exhibits the largest in-plane anisotropy. HAADF-STEM cross-section analysis of the Co36Fe64 thin film stack revealed Cu interdiffusion into the magnetic layer. The degree of interdiffusion was found to be up to 7x higher at grain boundaries as compared the bulk of the polycrystalline grains. The incorporation of Cu into the ferromagnetic layer adversely impacts magnetic damping. Reducing impurities in the magnetic layer by improving the growth chamber base pressure resulted in a reduction of magnetic damping of 18%. The diffraction analysis revealed that the primary growth direction of Co36Fe64 is [101] and that of Cu buffer layer is [111], these planes are perpendicular to their respective [101] planes and for this composition the lattice mismatch was determined to be 0.9325%. The lattice mismatch decreases with increasing Co content and hence the lattice strain. The diffusion of Cu into the ferromagnet creates magnon scattering centers and local changes in magnetic properties. Both factors negatively influence magnetic damping.

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Samanvaya S. Gaur, Rosa Diaz, Ernesto E. Marinero. 2025-01-15. Compositional dependence of magnetic damping in sputter-deposited CoxFe1-x thin films. https://arxiv.org/abs/2501.08948

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