arXiv · 2412.11288
Towards Improved Polarization Uniformity in Ferroelectric Hf$_{0.5}$Zr$_{0.5}$O$_2$ Devices within Back End of Line Thermal Budget for Memory and Neuromorphic Applications
Abstract
Thin film ferroelectric devices with ultralow power operation, non-volatile data retention and fast and reliable switching are attractive for non-volatile memory and as synaptic weight elements. However, low thermal budget ferroelectric oxides suffer from crystalline inhomogeneity and defects that makes their large-scale circuit integration challenging. Here, we report on the thermally engineered way to induce wafer-scale homogeneity in Hf$_{0.5}$Zr$_{0.5}$O$_2$ capacitors that can lead to high device reliability making their integration possible in ultralow power memory and neuromorphic computing hardware.
Explore related subjects
Keep this discovery
Padma Srivari, Ella Paasio, Xinye Li, Sayani Majumdar. 2024-12-15. Towards Improved Polarization Uniformity in Ferroelectric Hf$_{0.5}$Zr$_{0.5}$O$_2$ Devices within Back End of Line Thermal Budget for Memory and Neuromorphic Applications. https://arxiv.org/abs/2412.11288
Cite the original work for its findings. Save a collection to share your selection of sources.