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arXiv · 2208.11453

Multi-scale plasticity homogenization of Sn-3Ag-0.5Cu: from β-Sn micropillars to polycrystals with intermetallics

Yilun Xu·Tianhong Gu·Jingwei Xian·Finn Giuliani·T. Ben Britton·Christopher M. Gourlay·Fionn P. E. Dunne
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Abstract

The mechanical properties of $β$-Sn single crystals have been systematically investigated using a combined methodology of micropillar tests and rate-dependent crystal plasticity modelling. The slip strength and rate sensitivity of several key slip systems within $β$-Sn single crystals have been determined. Consistency between the numerically predicted and experimentally observed slip traces has been shown for pillars oriented to activate single and double slip. Subsequently, the temperature-dependent, intermetallic-size-governing behaviour of a polycrystal $β$-Sn-rich alloy SAC305 (96.5Sn-3Ag-0.5Cu wt%) is predicted through a multi-scale homogenization approach, and the predicted temperature- and rate-sensitivity reproduce independent experimental results. The integrated experimental and numerical approaches provide mechanistic understanding and fundamental material properties of microstructure-sensitive behaviour of electronic solders subject to thermomechanical loading, including thermal fatigue.

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Yilun Xu, Tianhong Gu, Jingwei Xian, Finn Giuliani, T. Ben Britton, Christopher M. Gourlay, Fionn P. E. Dunne. 2022-08-24. Multi-scale plasticity homogenization of Sn-3Ag-0.5Cu: from β-Sn micropillars to polycrystals with intermetallics. https://doi.org/10.1016/j.msea.2022.143876

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