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arXiv · 2010.08411

An upgraded ultra-high vacuum magnetron-sputtering system for high-versatility and software-controlled deposition

Arnaud le Febvrier·Ludvig Landalv·Thomas Liersch·David Sandmark·Per Sandstrom·Per Eklund
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Abstract

Magnetron sputtering is a widely used physical vapor deposition technique. Reactive sputtering is used for the deposition of, e.g, oxides, nitrides and carbides. In fundamental research, versatility is essential when designing or upgrading a deposition chamber. Furthermore, automated deposition systems are the norm in industrial production, but relatively uncommon in laboratory-scale systems used primarily for fundamental research. Combining automatization and computerized control with the required versatility for fundamental research constitutes a challenge in designing, developing, and upgrading laboratory deposition systems. The present article provides a detailed description of the design of a lab-scale deposition chamber for magnetron sputtering used for the deposition of metallic, oxide, nitride and oxynitride films with automated controls, dc or pulsed bias, and combined with a coil to enhance the plasma density near the substrate. LabVIEW software (provided as Supplementary Information) has been developed for a high degree of computerized or automated control of hardware and processes control and logging of process details.

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Arnaud le Febvrier, Ludvig Landalv, Thomas Liersch, David Sandmark, Per Sandstrom, Per Eklund. 2021-01-27. An upgraded ultra-high vacuum magnetron-sputtering system for high-versatility and software-controlled deposition. https://doi.org/10.1016/j.vacuum.2021.110137

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