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arXiv · 1611.02346

A versatile, inexpensive integrated photonics platform

Jeffrey M. Shainline·Sonia M. Buckley·Nima Nader·Cale M. Gentry·Kevin C. Cossel·Miloš Popović·Nathan R. Newbury·Sae Woo Nam·Richard P. Mirin
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Abstract

We present an approach to fabrication and packaging of integrated photonic devices that utilizes waveguide and detector layers deposited at near-ambient temperature. All lithography is performed with a 365 nm i-line stepper, facilitating low cost and high scalability. We have shown low-loss SiN waveguides, high-$Q$ ring resonators, critically coupled ring resonators, 50/50 beam splitters, Mach-Zehnder interferometers (MZIs) and a process-agnostic fiber packaging scheme. We have further explored the utility of this process for applications in nonlinear optics and quantum photonics. We demonstrate spectral tailoring and octave-spanning supercontinuum generation as well as the integration of superconducting nanowire single photon detectors with MZIs and channel-dropping filters. The packaging approach is suitable for operation up to 160 \degree C as well as below 1 K. The process is well suited for augmentation of existing foundry capabilities or as a stand-alone process.

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Jeffrey M. Shainline, Sonia M. Buckley, Nima Nader, Cale M. Gentry, Kevin C. Cossel, Miloš Popović, Nathan R. Newbury, Sae Woo Nam, Richard P. Mirin. 2016-11-07. A versatile, inexpensive integrated photonics platform. https://doi.org/10.1364/oe.25.010322

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