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arXiv · 1412.2842

Topology of desiccation crack patterns in clay and invariance of crack interface area with thickness

Abstract

We study the crack patterns developed on desiccating films of an aqueous colloidal suspension of bentonite on a glass substrate. Varying the thickness of the layer $h$ gives the following new and interesting results: (i)We identify a critical thickness $h_{c}$, above which isolated cracks join each other to form a fully connected network. A topological analysis of the crack network shows that the Euler number falls to a minimum at $h_{c}$. (ii) We find further, that the total vertical surface area of the clay $A_v$, which has opened up due to cracking, is a constant independent of the layer thickness for $h \geq h_c$. (iii) The total area of the glass substrate $A_s$, exposed by the hierarchical sequence of cracks is also a constant for $h \geq h_c$. These results are shown to be consistent with a simple energy conservation argument, neglecting dissipative losses. (iv) Finally we show that if the crack pattern is viewed at successively finer resolution, the total cumulative area of cracks visible at a certain resolution, scales with the layer thickness. A suspension of Laponite in methanol is found to exhibit similar salient features (i)-(iv), though in this case the crack initiation process for very thin layers is quite different.

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Tajkera Khatun, Tapati Dutta, Sujata Tarafdar. 2014-12-09. Topology of desiccation crack patterns in clay and invariance of crack interface area with thickness. https://arxiv.org/abs/1412.2842

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