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arXiv · 1405.4559

Atomistic Kinetic Monte Carlo Simulations of Polycrystalline Copper Electrodeposition

Tanyakarn Treeratanaphitak·Mark D. Pritzker·Nasser Mohieddin Abukhdeir
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Abstract

A high-fidelity kinetic Monte Carlo (KMC) simulation method (T. Treeratanaphitak, M. Pritzker, N. M. Abukhdeir, Electrochim. Acta 121 (2014) 407--414) using the semi-empirical multi-body embedded-atom method (EAM) potential has been extended to model polycrystalline metal electrodeposition. Simulations using KMC-EAM are performed over a range of overpotentials to predict the effect on deposit texture evolution. Roughness-time power law behaviour ($\propto t^\beta$) is observed where $\beta=0.62 \pm 0.12$, which is in good agreement with past experimental results. Furthermore, the simulations provide insights into the dynamics of sub-surface deposit morphology which are not directly accessible from experimental measurements.

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Tanyakarn Treeratanaphitak, Mark D. Pritzker, Nasser Mohieddin Abukhdeir. 2014-05-18. Atomistic Kinetic Monte Carlo Simulations of Polycrystalline Copper Electrodeposition. https://doi.org/10.1016/j.elecom.2014.07.001

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