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arXiv · 1108.2226

Near-field scanning microwave microscope for interline capacitance characterization of nanoelectronics interconnect

Vladimir V. Talanov·Andrew R. Schwartz
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Abstract

We have developed a noncontact method for measurement of the interline capacitance in Cu/low-k interconnect. It is based on a miniature test vehicle with net capacitance of a few femto-Farads formed by two 20-μm-long parallel wires (lines) with widths and spacings the same as those of the interconnect wires of interest. Each line is connected to a small test pad. The vehicle impedance is measured at 4 GHz by a near-field microwave probe with 10 μm probe size via capacitive coupling of the probe to the vehicle's test pads. Full 3D finite element modeling at 4 GHz confirms that the microwave radiation is concentrated between the two wires forming the vehicle. An analytical lumped element model and a short/open calibration approach have been proposed to extract the interline capacitance value from the measured data. We have validated the technique on several test vehicles made with copper and low-k dielectric on a 300 mm wafer. The vehicles interline spacing ranges from 0.09 to 1 μm and a copper line width is 0.15 μm. This is the first time a near-field scanning microwave microscope has been applied to measure the lumped element impedance of a test vehicle.

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Vladimir V. Talanov, Andrew R. Schwartz. 2011-08-10. Near-field scanning microwave microscope for interline capacitance characterization of nanoelectronics interconnect. https://doi.org/10.1109/tmtt.2009.2017352

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