Sensor/ROIC Integration using Oxide Bonding

Zhenyu Ye

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arXiv · 0902.2801

Sensor/ROIC Integration using Oxide Bonding

Zhenyu Ye

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Abstract

We explore the Ziptronix Direct Bond Interconnect technology for the integration of sensors and readout integrated circuits (ROICs) for high energy physics. The technology utilizes an oxide bond to form a robust mechanical connection between layers which serves to assist with the formation of metallic interlayer connections. We report on testing results of sample sensors bonded to ROICs and thinned to 100 microns.

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Zhenyu Ye. 2009-02-16. Sensor/ROIC Integration using Oxide Bonding. https://arxiv.org/abs/0902.2801

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