arXiv · 0801.1046
High Performance Thermal Interface Technology Overview
Abstract
An overview on recent developments in thermal interfaces is given with a focus on a novel thermal interface technology that allows the formation of 2-3 times thinner bondlines with strongly improved thermal properties at lower assembly pressures. This is achieved using nested hierarchical surface channels to control the particle stacking with highly particle-filled materials. Reliability testing with thermal cycling has also demonstrated a decrease in thermal resistance after extended times with longer overall lifetime compared to a flat interface.
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R. Linderman, T. Brunschwiler, B. Smith, B. Michel. 2008-01-07. High Performance Thermal Interface Technology Overview. https://arxiv.org/abs/0801.1046
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