arXiv · 0801.1003
Evaluation of the impact of solder die attach versus epoxy die attach in a state of the art power package
Abstract
Subject of this paper is the thermal investigation of epoxy (EDA) and solder (SDA) die attaches by a comparison of an ASIC with multiple heat sources in different package assemblies. Static and transient thermal measurements and simulations were performed to investigate the thermal behavior of two samples in a state of the art QFP power package differing only in the die attach material (EDA and SDA).
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J. Czernohorsky, B. Maj, Matthias Viering, L. Wright, G. Balanon. 2008-01-07. Evaluation of the impact of solder die attach versus epoxy die attach in a state of the art power package. https://arxiv.org/abs/0801.1003
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