arXiv · 0709.1836
Design issues of a variable thermal resistance
Abstract
Some years ago we have proposed a thermal mount with electronically variable thermal resistance [1]. In this earlier work the feasibility of such a structure has been demonstrated. Now we intend to realize this mount in a maturated form, suitable to the everyday use in the practice of package thermal qualification and modeling. The design of such a device raises a number of new questions and problems. The present paper is dealing with these problems and the possible solutions.
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V. Szekely, G. Mezosi. 2007-09-12. Design issues of a variable thermal resistance. https://arxiv.org/abs/0709.1836
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