arXiv · 0708.4080
Computer simulated heat flow dynamics in Silicon at low temperatures
Abstract
The thermal characteristics of silicon between 15 and 300 deg K are investigated by applying a computer program on the solution of the differential heat diffusion equation. The computer model is linked to high-purity silicon through a set of experimental data. The numerical results are given in graphic form and show, in particular, very short diffusion transit times across long distances. The computed figures require experimental confrontations; a test set-up is proposed.
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H. Diedrich, R. Liberati. 2007-08-30. Computer simulated heat flow dynamics in Silicon at low temperatures. https://arxiv.org/abs/0708.4080
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